Model for life prediction of fatigue-creep interaction

This paper discusses the development of a procedure for computing creep and stress relaxation at the critical location in a through-hole structure. A high-speed methodology was developed for calculating cyclic creep and stress relaxation at critical locations of a pile on elastic foundation subjected to cyclic thermomechanical loading. This simplified analysis was exercised for two cases involving a pile on elastic foundation problem with different thermomechanical loading. The simplified analysis exhibited no computational problems and gave a stable solution for the full dwell times. Comparisons made with experimental results for these cases gave an excellent agreement at a much faster computing time. This simplified procedure is expected to be even much faster when an entire pile on elastic foundation assembly is analyzed.

[1]  Wei Zhou,et al.  A New Creep Constitutive Model for Eutectic Solder Alloy , 2002 .

[2]  E. W. C. Wilkins,et al.  Cumulative damage in fatigue , 1956 .

[3]  J. M. Fusaro,et al.  Reliability model for micro-miniature electronic packages , 1997 .

[4]  Frank Garofalo,et al.  Fundamentals of creep and creep-rupture in metals , 1965 .

[5]  Miklós Hetényi,et al.  Beams on Elastic Foundation: Theory with Applications in the Fields of Civil and Mechanical Engineering , 1946 .

[6]  Peter A. Engel,et al.  Thermal Stress Analysis of Pin Grid Array Structures: Module and Card Interactions , 1992 .

[7]  Michael Pecht,et al.  Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach , 1992 .

[8]  R. Darveaux.  Effect of simulation methodology on solder joint crack growth correlation , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[9]  K. Kishimoto,et al.  Fatigue Life Estimation of Solder Joints in SMT-PGA Packages , 1998 .

[10]  A. Kaufman,et al.  Cyclic creep analysis from elastic finite-element solutions , 1986 .

[11]  Bart Vandevelde,et al.  Thermomechanical models for leadless solder interconnections in flip chip assemblies , 1998 .

[12]  R. Darveaux,et al.  Fatigue analysis of flip chip assemblies using thermal stress simulations and a Coffin-Manson relation , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

[13]  Exposition,et al.  Structural analysis in microelectronic and fiber optic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California , 1991 .

[14]  J. Lau,et al.  Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate , 1991 .

[15]  Guna S Selvaduray,et al.  Solder joint fatigue models: review and applicability to chip scale packages , 2000 .

[16]  Peter A. Engel,et al.  Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems , 1992 .

[17]  Sheng Liu,et al.  On the life prediction and accelerated testing of solder joints , 1998, Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180).

[18]  Shilak Shakya.  Stress analysis of bonded axisymmetric assemblies under thermal loading : applications in microelectronics , 2000 .

[19]  Robert Darveaux,et al.  Solder Joint Fatigue Life Model , 1997 .

[20]  Tsung-Yu Pan,et al.  Thermal cycling induced plastic deformation in solder joints. II. Accumulated deformation in through-hole joints , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.