Study of reliability-efficiency tradeoff of active thermal control for power electronic systems

Abstract Active thermal control for power modules can potentially extend the lifetime of the converter. This paper investigates the trade-off between the lifetime extension or de-rating and its cost due to the efficiency reduction. A short review on the existing approaches using control to reduce thermal stress of power modules is presented. Based on a given junction temperature profile, a method to evaluate the active thermal control's trade-off is presented. The concept is validated on a laboratory setup, where active thermal control is implemented by adapting the switching frequency. A discussion of the possible lifetime extension at the efficiency's expense is finally given.

[1]  Mauro Ciappa.  Lifetime prediction on the base of mission profiles , 2005, Microelectron. Reliab..

[2]  Marco Liserre,et al.  Review of active thermal and lifetime control techniques for power electronic modules , 2014, 2014 16th European Conference on Power Electronics and Applications.

[3]  Dawei Xiang,et al.  Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification , 2012, IEEE Transactions on Power Electronics.

[4]  Zhengming Zhao,et al.  Current sharing of IGBT modules in parallel with thermal imbalance , 2010, 2010 IEEE Energy Conversion Congress and Exposition.

[5]  Frede Blaabjerg,et al.  Thermal optimised modulation methods of three-level neutral-point-clamped inverter for 10 MW wind turbines under low-voltage ride through , 2012 .

[6]  Huai Wang,et al.  Design for Reliability of Power Electronics in Renewable Energy Systems , 2014 .

[7]  M.R. Zolghadri,et al.  Novel thermal based current sharing control of parallel converters , 2004, INTELEC 2004. 26th Annual International Telecommunications Energy Conference.

[8]  S. Bernet,et al.  Estimation and measurement of junction temperatures in a three-level voltage source converter , 2005, Fourtieth IAS Annual Meeting. Conference Record of the 2005 Industry Applications Conference, 2005..

[9]  Huai Wang,et al.  Overview of catastrophic failures of freewheeling diodes in power electronic circuits , 2013, Microelectron. Reliab..

[10]  J. Driesen,et al.  Thermal management in traction applications as a constraint optimal control problem , 2012, 2012 IEEE Vehicle Power and Propulsion Conference.

[11]  I. Cotton,et al.  Impact of Thermal Cycling in Humid Environments on Power Electronic Modules , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[12]  Mahera Musallam,et al.  An Efficient Implementation of the Rainflow Counting Algorithm for Life Consumption Estimation , 2012, IEEE Transactions on Reliability.

[13]  Jorg Roth-Stielow,et al.  Chances and limits of a thermal control for a three-phase voltage source inverter in traction applications using permanent magnet synchronous or induction machines , 2011, Proceedings of the 2011 14th European Conference on Power Electronics and Applications.

[14]  D.A. Murdock,et al.  Active thermal control of power electronic modules , 2003, IEEE Transactions on Industry Applications.

[15]  Chris Bailey,et al.  Design for reliability of power electronics modules , 2009, Microelectron. Reliab..

[16]  Reinhold Bayerer,et al.  Advanced packaging yields higher performance and reliability in power electronics , 2010, Microelectron. Reliab..

[17]  Frede Blaabjerg,et al.  An overview of the reliability prediction related aspects of high power IGBTs in wind power applications , 2011, Microelectron. Reliab..

[18]  Dianguo Xu,et al.  Seamless Transition Control for Modular Multilevel Converters When Inserting a Cold-Reserve Redundant Submodule , 2015, IEEE Transactions on Power Electronics.

[19]  Robert D. Lorenz,et al.  Active thermal control of power electronics modules , 2003 .

[20]  Marco Liserre,et al.  Improved Reliability of Power Modules: A Review of Online Junction Temperature Measurement Methods , 2014, IEEE Industrial Electronics Magazine.

[21]  Frede Blaabjerg,et al.  Operating and Loading Conditions of a Three-Level Neutral-Point-Clamped Wind Power Converter Under Various Grid Faults , 2014, IEEE Transactions on Industry Applications.

[22]  Lixiang Wei,et al.  Analysis of PWM frequency control to improve the lifetime of PWM inverter , 2009, 2009 IEEE Energy Conversion Congress and Exposition.

[23]  Johan Driesen,et al.  Optimal Control of Traction Motor Drives Under Electrothermal Constraints , 2014, IEEE Journal of Emerging and Selected Topics in Power Electronics.

[24]  S. Hartmann,et al.  Analysis of insulation failure modes in high power IGBT modules , 2005, Fourtieth IAS Annual Meeting. Conference Record of the 2005 Industry Applications Conference, 2005..

[25]  A. Castellazzi,et al.  Temperature adaptive driving of power semiconductor devices , 2010, 2010 IEEE International Symposium on Industrial Electronics.

[26]  Ahmet M. Hava,et al.  Carrier-based PWM-VSI overmodulation strategies: analysis, comparison, and design , 1998 .

[27]  P. Hofer,et al.  Paralleling intelligent IGBT power modules with active gate-controlled current balancing , 1996, PESC Record. 27th Annual IEEE Power Electronics Specialists Conference.

[28]  M. Liserre,et al.  Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities , 2013, IEEE Industrial Electronics Magazine.

[29]  Frede Blaabjerg,et al.  Mission profile translation to capacitor stresses in grid-connected photovoltaic systems , 2014, 2014 IEEE Energy Conversion Congress and Exposition (ECCE).

[30]  Josef Lutz,et al.  Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime , 2008 .

[31]  Vanessa Smet.  Aging and failure modes of IGBT power modules undergoing power cycling in high temperature environments , 2010 .

[32]  Gerhard Wachutka,et al.  Rigorous model and network for transient thermal problems , 2002 .

[33]  Pericle Zanchetta,et al.  Advances in the dynamic active cooling of power electronic modules , 2012 .

[34]  Uwe Scheuermann.  Increasing component reliability by eliminating solder interfaces , 2009, 2009 13th European Conference on Power Electronics and Applications.

[35]  Stefano Bifaretti,et al.  Distributed commutations pulse-width modulation technique for high-power AC/DC multi-level converters , 2012 .

[36]  Ke Ma.  Thermal " Loading " and " Lifetime " Estimation " for " Power " Device " Considering " Mission " Profiles " in " Wind " Power " Converter " , 2014 .

[37]  F. Crescimbini,et al.  Thermal regulation as control reference in electric drives , 2012, 2012 15th International Power Electronics and Motion Control Conference (EPE/PEMC).

[38]  Frede Blaabjerg,et al.  Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics , 2014, IEEE Journal of Emerging and Selected Topics in Power Electronics.

[39]  Feng Guo,et al.  Thermoelectric Cooling for Power Electronics Circuits: Modeling and Active Temperature Control , 2014, IEEE Transactions on Industry Applications.

[40]  Bongtae Han,et al.  Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review , 2015, IEEE Transactions on Power Electronics.

[41]  S. Haumann,et al.  Novel bonding and joining technology for power electronics - Enabler for improved lifetime, reliability, cost and power density , 2013, 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC).

[42]  P. Zanchetta,et al.  Adaptive cooling of power modules for reduced power and thermal cycling , 2011, Proceedings of the 2011 14th European Conference on Power Electronics and Applications.

[43]  Xiaoxiao Yu,et al.  Control of Parallel Connected Power Converters for Low Voltage Microgrid—Part II: Dynamic Electrothermal Modeling , 2010, IEEE Transactions on Power Electronics.

[44]  Marco Liserre,et al.  Active thermal management for a single-phase H-Bridge inverter employing switching frequency control , 2016 .

[45]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[46]  Marco Liserre,et al.  Thermal stress reduced maximum power point tracking for two stages photovoltaic converters , 2015, 2015 IEEE Energy Conversion Congress and Exposition (ECCE).

[47]  V. Blasko,et al.  On line thermal model and thermal management strategy of a three phase voltage source inverter , 1999, Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370).

[48]  M. Liserre,et al.  Reactive power influence on the thermal cycling of multi-MW wind power inverter , 2012, 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC).