论文信息 - Mechanistic studies of hydrophilic wafer bonding and Si exfoliation for SOI fabrication - 字舞流文

Mechanistic studies of hydrophilic wafer bonding and Si exfoliation for SOI fabrication

D. Jacobson | C. Hsieh | M. Weldon | C. A. Goodwin | B. Dennis | E. Chaban | V. Marsico | A. Mills | A. Pinczuk | Y.J. Chabal | S.B. Christman | J.B. Sapjeta