Multi-carrier platform for wireless communications. Part 1: High-performance, high-throughput TDMA and DS-CDMA via multi-carrier implementations

Multi-carrier technologies in general, and OFDM and MC-CDMA in particular, are quickly becoming an integral part of the wireless landscape. In this first of a two-part survey, the authors present the innovative transmit/receive multi-carrier implementation of TDMA and DS-CDMA systems. Specifically, at the transmit side, the pulse shape (in TDMA) and the chip shape (in DS-CDMA) corresponds to a linear combining of in-phase harmonics (called a CI signal). At the receiver side, traditional time-domain processing (equalization in TDMA and RAKE reception in DS-CDMA) is replaced by innovative frequency based processing. Here, receivers decompose pulse (or chip) shapes into carrier subcomponents and recombine these in a manner achieving both high frequency diversity gain and low MAI. The resulting system outperforms traditional TDMA and DS-CDMA systems by 10–14 dB at typical BERs, and, by application of pseudo-orthogonal pulse shapes (chip shapes), is able to double system throughput while maintaining performance gains of up to 8 dB. Copyright © 2002 John Wiley & Sons, Ltd.

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