A novel automated inspecting system has been developed that uses a multifunction sensor which moves on a printed circuit board (PCB) at high speed and measures 3-D information and the brightness of the object. Due to the capability of the 3-D shape-scanning method, this 3-D visual inspector can inspect solder-joint quality as well as solder volume and shape, regardless of the quality of PCB used and the degree of bend on the circuit board. The operating principle and specifications of this device are presented.<<ETX>>