A novel fully integrated fan controller for advanced computer systems

A low-cost, high-efficiency, compact architecture of a PWM (pulse-width-modulation) drive fan controller is designed for use in an embedded multicomputer system with an integrated hierarchical thermal management scheme. This pure digital design yields lower cost and higher conventional linear drive fan providing the functionality and advantages of PWM drive fan controllers. The implementation and system integration of this circuit is also described in this paper.

[1]  M. Rencz,et al.  Thermal testing methods to increase system reliability , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[2]  J. Steele.  ACPI thermal sensing and control in the PC , 1998, Wescon/98. Conference Proceedings (Cat. No.98CH36265).

[3]  Mark Horowitz,et al.  Energy dissipation in general purpose microprocessors , 1996, IEEE J. Solid State Circuits.

[4]  Jeffrey T. Draper,et al.  A bus-efficient low-latency network interface for the PDSS multicomputer , 1997, Proceedings. The Sixth IEEE International Symposium on High Performance Distributed Computing (Cat. No.97TB100183).

[5]  C. Cremers,et al.  A semi-analytical method to predict printed circuit board package temperatures , 1991, 1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium.

[6]  H. Mantooth,et al.  Modeling and Simulation of Electrical and Thermal Interaction , 1995 .

[7]  John Choma,et al.  Implementation of a Temperature Monitoring Interface Circuit for PowerPC systems , 2000, Proceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144).

[8]  R. Allmon,et al.  High-performance microprocessor design , 1998, IEEE J. Solid State Circuits.

[9]  John Choma,et al.  A novel model for on-chip heat dissipation , 1998, IEEE. APCCAS 1998. 1998 IEEE Asia-Pacific Conference on Circuits and Systems. Microelectronics and Integrating Systems. Proceedings (Cat. No.98EX242).

[10]  Herming Chiueh,et al.  A high–speed CMOS on–chip temperature sensor , 1999 .

[11]  H. Vinke,et al.  Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[12]  Jeffrey T. Draper,et al.  Thermal Management in Embedded Systems Using MEMS , 1998, IPPS/SPDP Workshops.

[13]  Robert W. Brodersen.  Anatomy of a Silicon Compiler , 1992 .