Thin film to nano copper deposition by special additives on an ecofriendly electroless bath

[1]  A. Cobley,et al.  Functionalised copper nanoparticle catalysts for electroless copper plating on textiles , 2020 .

[2]  Z. Kang,et al.  Preparation and conductive property of Cu coatings and Cu-graphene composite coatings on ABS substrate , 2020, Nanotechnology.

[3]  W. Dow,et al.  Polyimide Metallization Using Nickel Nano-Film as both Catalyst and Barrier Layer of Copper Electroless Deposition , 2019, Journal of The Electrochemical Society.

[4]  Q. Shen,et al.  Fabrication and microstructure of W-Cu composites prepared from Ag-coated Cu powders by electroless plating , 2019, Surface and Coatings Technology.

[5]  A. Heidarzadeh,et al.  Manufacturing of copper coated SiC ceramic particles for metal matrix composites: optimizing the electroless deposition parameters , 2018, Materials Research Express.

[6]  T. Bechtold,et al.  Conductive layers through electroless deposition of copper on woven cellulose lyocell fabrics , 2018, Surface and Coatings Technology.

[7]  Y. Shacham-Diamand,et al.  Highly Conductive Copper Film on Inkjet-Printed Porous Silver Seed for Flexible Electronics , 2018 .

[8]  M. Tomić,et al.  The Inhibitive Effect of Vitamin-C on the Corrosive Performance of Steel in HCl Solutions , 2013, International Journal of Electrochemical Science.

[9]  R. Akolkar,et al.  Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent , 2013 .

[10]  Xuan Meng,et al.  A Novel Application of Methanesulfonic Acid as Catalyst for the Alkylation of Olefins with Aromatics , 2012 .

[11]  W. Sha,et al.  Surface Morphology of Electroless Copper Deposits Using Different Reducing Agents , 2008 .

[12]  Lei Liu,et al.  Effects of K4Fe(CN)6 on electroless copper plating using hypophosphite as reducing agent , 2007 .

[13]  E. Norkus,et al.  Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions , 2007 .

[14]  E. Norkus,et al.  Obtaining of high surface roughness copper deposits by electroless plating technique , 2006 .

[15]  Y. Shacham-Diamand,et al.  Electrochemical Study of the Electroless Deposition of Co(W, B) Alloys , 2005 .

[16]  B. Nelson,et al.  Electrochemical Codeposition of Magnetic Particle-Ferromagnetic Matrix Composites for Magnetic MEMS Actuator Applications , 2004 .

[17]  Min Wu,et al.  Environmental benefits of methanesulfonic acid. Comparative properties and advantages , 1999 .

[18]  H. Sharghi,et al.  Alumina in Methanesulfonic Acid (AMA) as a New Efficient Reagent for Direct Acylation of Phenol Derivatives and Fries Rearrangement. A Convenient Synthesis of o-Hydroxyarylketones , 1998 .

[19]  N. Mandich,et al.  On the mechanisms of plating on plastics , 1993 .

[20]  J. E. Meerakker,et al.  On the mechanism of electroless plating. Part 3. Electroless copper alloys , 1990 .

[21]  M. Paunovic,et al.  The Effect of pH on Electroless Copper Deposition , 1983 .

[22]  M. Paunovic An Electrochemical Control System for Electroless Copper Bath , 1980 .

[23]  A. Brenner,et al.  Nickel plating on steel by chemical reduction , 1946 .