论文信息 - Picosecond imaging circuit analysis

Picosecond imaging circuit analysis

A newly developed optical method for noninvasively measuring the switching activity of operating CMOS integrated circuit chips is described. The method, denoted as picosecond imaging circuit analysis (PICA) can be used to characterize the gate-level performance of such chips and identify the locations and nature of their operational faults. The principles underlying PICA and examples of its use are discussed.

[1] Eckhard Wolfgang,et al. Electron beam testing , 1986 .

[2] Pia Sanda,et al. The attack of the "Holey Shmoos": a case study of advanced DFD and picosecond imaging circuit analysis (PICA) , 1999, International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034).

[3] John T. L. Thong,et al. Electron beam testing technology , 1993 .

[4] Yuan Taur,et al. Fundamentals of Modern VLSI Devices , 1998 .

[5] Mario Paniccia,et al. Novel optical probing technique for flip chip packaged microprocessors , 1998, Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270).

[6] D. P. Vallett,et al. Finding fault with deep-submicron ICs , 1997 .

[7] H. K. Heinrich,et al. Picosecond noninvasive optical detection of internal electrical signals in flip-chip-mounted silicon integrated circuits , 1990 .

[8] Yuan Taur,et al. A half-micron CMOS logic generation , 1995, IBM J. Res. Dev..

[9] Luca Selmi,et al. Silicon luminescence techniques for the characterization of hot-carrier and degradation phenomena in MOS devices , 1995 .