Fast reliability qualification of SiP products

For the purpose of rapidly identifying the functional weak points of SiP products and defining appropriate design rules, a new methodology is proposed to achieve fast reliability qualification. This new methodology is based on the moisture absorption behavior along the critical interface of a SiP carrier and on the most sensitive zone to delamination of the SiP carrier, determined by simulation and experimentally checked. In this paper, a new accelerated preconditioning is proposed and a new non destructive thermal method to monitor the delamination is presented. The effectiveness of this new stress test to accelerate the failure mechanism of the SiP carrier and the ability to detect delamination are evaluated by performing a DOE.

[1]  Christian Gautier,et al.  Silicon based system in package: Improvement of passive integration process to avoid TBMS failure , 2008, Microelectron. Reliab..

[2]  F. Murray Silicon based system-in-package: a passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization , 2005, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..

[3]  O. van der Sluis,et al.  Effect of aging of packaging materials on die surface cracking of a SiP carrier , 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

[4]  W.D. van Driel,et al.  Moisture effects on a system in package carrier , 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[6]  W.D. van Driel,et al.  Moisture diffusion model verification of packaging materials , 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

[7]  Laurent Béchou,et al.  Use of signal processing imaging for the study of a 3D package in harsh environment , 2006, Microelectron. Reliab..

[8]  B. Michel,et al.  Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches , 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.