Thermal performance of embedded active chips

Electronic circuit density is currently limited by the physical dimensions of the elements which compose the device. Therefore, 3D integration of chips into printed circuit boards is one approach being explored to keep pace with this continuous trend toward miniaturization and densification. Embedded passive components in printed circuit boards have been shown to reduce space requirements by 30% or more, achieve better HF signal integrity and also allow for cost reductions. Work on embedded active components is ongoing and is expected to achieve these same results and should additionally allow higher interconnect density and a dramatic functionality increase while maintain key PCB attributes of component and interconnects. This paper presents a thermal analysis of an enclosure which is intended to hold the PCB boards containing the active discrete chips. A transfer function is generated for this design including the effects of fan flow rate, ambient intake temperature, and geometric location. Finally, the two models are merged together such that the enclosure data is joined with the embedded chip model. A Monte Carlo simulation approach is used to understand and optimize the performance and operation of the combined systems.