Tactile metrology for active microsystems

Often active microsystems consist of hybrid structures. Usually tactile metrology is here the only possibility to check manufacturing tolerances in the sub-micrometer range and to guarantee a lasting quality assurance of the production. For characterizing microprobes with reference objects and for tactile measurements of micro-components a high precision 3d-positioning system was developed. The improvement of the probing system, which affects the measuring accuracy decisively, was the main topic of the research. First results of probing experiments are shown.