论文信息 - A New Grounding Scheme to Reduce the Electromagnetic Emission of Smart Power SoCs

A New Grounding Scheme to Reduce the Electromagnetic Emission of Smart Power SoCs

The paper deals with the electromagnetic emissions of smart power System-on-Chips (SoCs). The propagation of core-logic switching noise through the silicon substrate a nd through the package lead-frame is investigated and the effe ctiveness of three different substrate grounding solutions to at tenuate conducted emission is proved by means of computer analyses a nd experimental tests.

Franco Fiori | M. Merlin

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