High-performance vertical transition for broadband and millimetre-wave BGA module packaging

A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full- wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.

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