Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
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S. Gates | D. Edelstein | T. Hook | D. Priyadarshini | B. Peethala | P. McLaughlin | V. Paruchuri | C. Hu | E. Liniger | C. Penny | P. Kerber | L. Clevenger | J. Chen | H. Shobha | J. Lee | G. Bonilla | R. Quon | S. Nguyen | I. Seshadri | E. Huang