Layout strategy of P+ pick-up on the LV nMOST ESD reliability for 0.6μm to 0.18μm CMOS technologies
暂无分享,去创建一个
A multi-finger LV nMOST is often applied to the input/output pads as electrostatic discharge protection (ESD) elements. However, the non-uniform turned-on phenomenon always occurred, i.e. these sub-nMOSTs can't be turned-on simultaneously. The ESD current will be passed through a few turned-on MOSTs. It was due to the RB resistance of parasitic bipolar transistor for each finger transistor in silicon bulk region is quite different. In this paper, the P+ pick-up area in source-side influence on the protection components in ESD capability of input/output pads will be investigated for 0.6μm to 0.18μm CMOS technologies. Here, the best stripe number choice of P+ pick-up will be carried out the important snapback parameters. We focus on exploring the value of secondary breakdown current (It2) and some physical parameters for the ESD robustness. Hopefully, it does effectively enhance ESD capability to solve the exactly non-uniform turned-on issue.
[1] Yang Wang,et al. Investigation of pickup effect for multi-fingered ESD devices in 0.5 μm 5V/ 18V CDMOS process , 2012 .
[2] Chun-Yu Lin,et al. Impact of layout pickups to ESD robustness of MOS transistors in sub 100-nm CMOS process , 2010, 2010 International Symposium on Next Generation Electronics.
[3] Ming-Dou Ker,et al. The Impact of Inner Pickup on ESD Robustness of Multi-Finger NMOS in Nanoscale CMOS Technology , 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.