A novel cavity-first process for flexible fabrication of MEMS on silicon on insulator (SOI) wafer

[1]  R. Maeda,et al.  Amorphous fluoropolymer protective coatings for front-side MEMS releasing by hydrofluoric acid vapor etching , 2014 .

[2]  Jian Lu,et al.  Analytical and Experimental Study on Sensitivity of Planar Piezoresistive Vibration Sensor , 2013 .

[3]  R. Maeda,et al.  Flexible integration of MEMS and IC for low-cost production of wireless sensor nodes , 2013 .

[4]  Jian Lu,et al.  High-Efficient Chip to Wafer Self-Alignment and Bonding Applicable to MEMS-IC Flexible Integration , 2013, IEEE Sensors Journal.

[5]  Dacheng Zhang,et al.  Inter-CMOS process for monolithic integrated MEMS resonator , 2012, 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.

[6]  Frank Niklaus,et al.  Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS , 2011, IEEE Journal of Selected Topics in Quantum Electronics.

[7]  J. Lau,et al.  C2W bonding method for MEMS applications , 2008, 2008 10th Electronics Packaging Technology Conference.

[8]  J. Dekker,et al.  Direct Bonding of Oxidized Cavity Wafers , 2008 .

[9]  M. Esashi,et al.  Wafer level packaging of MEMS , 2008, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.

[10]  A. Witvrouw,et al.  CMOS-MEMS Integration: Why, How and What? , 2006, 2006 IEEE/ACM International Conference on Computer Aided Design.

[11]  J. Dekker,et al.  Silicon-on-Insulator Wafers with Buried Cavities , 2006 .

[12]  J. Berenschot,et al.  Fabrication of thick silicon nitride blocks for integration of RF devices , 2005 .

[13]  Anna W. Topol,et al.  Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[14]  H. Fujita,et al.  Vapor Hydrofluoric Acid Sacrificial Release Technique for Micro Electro Mechanical Systems Using Labware , 2003 .

[15]  K. J. Gabriel,et al.  Post-CMOS processing for high-aspect-ratio integrated silicon microstructures , 2002 .

[16]  M. Schmidt,et al.  Design of sealed cavity microstructures formed by silicon wafer bonding , 1993 .