A novel cavity-first process for flexible fabrication of MEMS on silicon on insulator (SOI) wafer
暂无分享,去创建一个
Ryutaro Maeda | Hideki Takagi | Jian Lu | R. Maeda | Jian Lu | Lan Zhang | H. Takagi | Lan Zhang
[1] R. Maeda,et al. Amorphous fluoropolymer protective coatings for front-side MEMS releasing by hydrofluoric acid vapor etching , 2014 .
[2] Jian Lu,et al. Analytical and Experimental Study on Sensitivity of Planar Piezoresistive Vibration Sensor , 2013 .
[3] R. Maeda,et al. Flexible integration of MEMS and IC for low-cost production of wireless sensor nodes , 2013 .
[4] Jian Lu,et al. High-Efficient Chip to Wafer Self-Alignment and Bonding Applicable to MEMS-IC Flexible Integration , 2013, IEEE Sensors Journal.
[5] Dacheng Zhang,et al. Inter-CMOS process for monolithic integrated MEMS resonator , 2012, 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.
[6] Frank Niklaus,et al. Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS , 2011, IEEE Journal of Selected Topics in Quantum Electronics.
[7] J. Lau,et al. C2W bonding method for MEMS applications , 2008, 2008 10th Electronics Packaging Technology Conference.
[8] J. Dekker,et al. Direct Bonding of Oxidized Cavity Wafers , 2008 .
[9] M. Esashi,et al. Wafer level packaging of MEMS , 2008, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
[10] A. Witvrouw,et al. CMOS-MEMS Integration: Why, How and What? , 2006, 2006 IEEE/ACM International Conference on Computer Aided Design.
[11] J. Dekker,et al. Silicon-on-Insulator Wafers with Buried Cavities , 2006 .
[12] J. Berenschot,et al. Fabrication of thick silicon nitride blocks for integration of RF devices , 2005 .
[13] Anna W. Topol,et al. Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[14] H. Fujita,et al. Vapor Hydrofluoric Acid Sacrificial Release Technique for Micro Electro Mechanical Systems Using Labware , 2003 .
[15] K. J. Gabriel,et al. Post-CMOS processing for high-aspect-ratio integrated silicon microstructures , 2002 .
[16] M. Schmidt,et al. Design of sealed cavity microstructures formed by silicon wafer bonding , 1993 .