Effect analysis of filler sizes on percolation threshold of isotropical conductive adhesives
暂无分享,去创建一个
Mingyuan Ge | Huayue Wu | Xuefei Wu | Zhang Guangxue | M. Ge | Jianzhong Jiang | Zhang Guangxue | Yonggang Wang | Jianzhong Jiang | Yonggang Wang | Xuefei Wu | Hua-yue Wu
[1] C. Wong,et al. Development of solder replacement isotropic conductive adhesives , 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
[2] Jianmin Qu,et al. Effects of nano-sized particles on electrical and thermal conductivities of polymer composites , 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..
[3] Osseo-Asare,et al. Synthesis of Nanosize Silica in a Nonionic Water-in-Oil Microemulsion: Effects of the Water/Surfactant Molar Ratio and Ammonia Concentration. , 1999, Journal of colloid and interface science.
[4] Daoqiang Lu,et al. Isotropic conductive adhesives filled with low-melting-point alloy fillers , 2000 .
[5] L. Li,et al. Electrical conduction models for isotropically conductive adhesive joints , 1997 .
[6] S. Purushothaman,et al. Development of high conductivity lead (Pb)-free conducting adhesives , 1996 .
[7] Jun Lin,et al. Formation of Ordered Arrays of Gold Nanoparticles from CTAB Reverse Micelles , 2001 .
[8] Catalano,et al. Synthesis and structural characterisation of CdS nanoparticles prepared in a four-components "water-in-oil" microemulsion , 2000, Micron.
[9] S. Kotthaus,et al. Study of isotropically conductive bondings filled with aggregates of nano-sited Ag-particles , 1997 .
[10] Lilei Ye,et al. Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives , 1999 .
[11] M. Sun. Conductivity of conductive polymer for flip chip bonding and BGA socket , 2001 .
[12] K. Okuyama,et al. Onset of electrical conduction in isotropic conductive adhesives: a general theory , 1999 .
[13] Frank G. Shi,et al. Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles , 1999 .