Laser Processing For Interconnect Technology

Laser processing of polyimide dielectric layers for use in high-density interconnect structures was studied. A pulsed excimer laser was used to photoetch via holes and a CW argon ion laser operating at 351 nm was used to selectively deposit catalytic amounts of palladium on polyimide. Subsequent immersion of the irradiated samples in an electroless copper solution resulted in selective copper deposition.