High-Temperature And Moisture-Ageing Reliability of High-Density Power Packages For Electric Vehicles

Reliability and failure mechanisms associated with high-density, high-temperature (175-250 °C) electronics in harsh environments were investigated. Test-structures were built to emulate both high-power and high-density packages. Different material sets were evaluated for various failure modes such as delamination and corrosion. Design guidelines for high-density and high-power automotive packages are provided with emerging and leading-edge packaging materials. A 40% reduction in the adhesion strength was seen after high-temperature ageing at 200 °C along with a discoloration of the polymer. The experimental results indicate a need for enhanced interfaces and improved material properties for long-term high-temperature reliability.