Metallic electromigration phenomena
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[1] G. T. Kohman,et al. Silver migration in electrical insulation , 1955 .
[2] Jerome B. Lando,et al. Fundamentals of physical chemistry , 1974 .
[3] V. Tierney,et al. The Nature and Rate of Creepage of Copper Sulfide Tarnish Films over Gold , 1981 .
[4] C. W. Jennings. Filament formation on printed wiring boards , 1975 .
[5] H. Naguib,et al. Silver Migration and the Reliability of Pd/Ag Conductors in Thick-Film Dielectric Crossover Structures , 1979 .
[6] P. Dumoulin,et al. Metal Migrations Outside the Package During Accelerated Life Tests , 1982 .
[7] J. Mitchell,et al. Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention , 1979, 17th International Reliability Physics Symposium.
[8] Alex Shumka,et al. Migrated-Gold Resistive Shorts in Microcircuits , 1975, 13th International Reliability Physics Symposium.
[9] T. L. Welsher,et al. CAF in Composite Printed-Circuit Substrates: Characterization, Modeling and a Resistant Material , 1980, 18th International Reliability Physics Symposium.
[10] G. Digiacomo. Metal Migration (Ag, Cu, Pb) in Encapsulated Modules and Time-to-Fail Model as a Function of the Environment and Package Properties , 1982, 20th International Reliability Physics Symposium.
[11] J. Black. Electromigration failure modes in aluminum metallization for semiconductor devices , 1969 .
[12] T. W. Griswold,et al. Migratory Gold Resistive Shorts: Chemical Aspects of a Failure Mechanism , 1975, 13th International Reliability Physics Symposium.
[13] Aaron Der Marderosian,et al. Humidity Threshold Variations for Dendrite Growth on Hybrid Substrates , 1977, 15th International Reliability Physics Symposium.
[14] T. E. Hartman,et al. Electromigration in thin gold films , 1969 .
[15] G. Kortüm,et al. Treatise on Electrochemistry , 1965 .
[16] Earl L. Parks,et al. The Distribution of Electromigration Failures , 1986, 24th International Reliability Physics Symposium.
[17] E. King. Qualitative analysis and electrolytic solutions , 1956 .
[18] Silver Migration in Glass Dams between Silver-Palladium Interconnections , 1975, IEEE Transactions on Electrical Insulation.
[19] F. d'Heurle. Electromigration and failure in electronics: An introduction , 1971 .
[20] R. Chaffin. Migration of Silver from Silver-Loaded Polyimide Adhesive Chip Bonds at High Temperatures , 1981 .
[21] R. P. Frankenthal,et al. Corrosion Failure Mechanisms for Gold Metallizations in Electronic Circuits , 1979 .
[22] J. Gagne. Silver Migration Model for Ag-Au-Pd Conductors , 1982 .
[23] E. Tsunashima. The Sandwich Coating Between Conductive Layers for the Prevention of Silver-Migrations on a Phenolic Board , 1978 .
[24] A. Mogro-Campero,et al. Simple estimate of electromigration failure in metallic thin films , 1982 .
[25] Rolf E. Hummel,et al. ON THE DIRECTION OF ELECTROMIGRATION IN THIN SILVER, GOLD, AND COPPER FILMS , 1971 .
[26] R.W. Pasco,et al. The Application of a Dynamic Technique to the Study of Electromigration Kinetics , 1983, 21st International Reliability Physics Symposium.
[27] N. Sbar,et al. Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl 2 , 1976 .
[28] J. Lahti,et al. The Characteristic Wearout Process in Epoxy-Glass Printed Circuits for High Density Electronic Packaging , 1979, 17th International Reliability Physics Symposium.
[29] J. Towner. Electromigration-Induced Short Circuit Failure , 1985, 23rd International Reliability Physics Symposium.
[30] H. Hartnagel,et al. XPS-Analysis of GaAs-Surface Quality Affecting Interelectrode Material Migration , 1985, 23rd International Reliability Physics Symposium.
[31] G. Milazzo. Electrochemistry: Theoretical Principles and Practical Applications , 1963 .
[32] L. C. Hall,et al. A Review of Corrosion Failure Mechanisms during Accelerated Tests Electrolytic Metal Migration , 1987 .
[33] Saul Chaikin,et al. Silver Migration and Printed Wiring , 1959 .
[34] L. Feinstein,et al. Performance of New Copper-Based Metallization Systems in an 85°C, 78% RH, SO 2 Contaminated Environment , 1979 .
[35] R. Thomas. Moisture, Myths, and Microcircuits , 1976 .
[36] F. d'Heurle,et al. Electromigration of Ni in Al thin‐film conductors , 1975 .
[37] J. Black. Physics of Electromigration , 1974 .
[38] M. S. Frant. Copper Sulfide Creep on Porous Electroplate , 1960 .