Metallic electromigration phenomena

Metallic electromigration can be defined as the movement of metallic material, usually through or across a nonmetallic medium, under the influence of an electric field. As such, it has assumed increasing importance in the performance and reliability of packaging systems that incorporate electric contacts. The characteristics of the different electromigration processes are discussed, including descriptions of related phenomena. The primary emphasis is on electrolytically controlled processes that take place under low power and typical ambient conditions. >

[1]  G. T. Kohman,et al.  Silver migration in electrical insulation , 1955 .

[2]  Jerome B. Lando,et al.  Fundamentals of physical chemistry , 1974 .

[3]  V. Tierney,et al.  The Nature and Rate of Creepage of Copper Sulfide Tarnish Films over Gold , 1981 .

[4]  C. W. Jennings Filament formation on printed wiring boards , 1975 .

[5]  H. Naguib,et al.  Silver Migration and the Reliability of Pd/Ag Conductors in Thick-Film Dielectric Crossover Structures , 1979 .

[6]  P. Dumoulin,et al.  Metal Migrations Outside the Package During Accelerated Life Tests , 1982 .

[7]  J. Mitchell,et al.  Conductive Anodic Filaments in Reinforced Polymeric Dielectrics: Formation and Prevention , 1979, 17th International Reliability Physics Symposium.

[8]  Alex Shumka,et al.  Migrated-Gold Resistive Shorts in Microcircuits , 1975, 13th International Reliability Physics Symposium.

[9]  T. L. Welsher,et al.  CAF in Composite Printed-Circuit Substrates: Characterization, Modeling and a Resistant Material , 1980, 18th International Reliability Physics Symposium.

[10]  G. Digiacomo Metal Migration (Ag, Cu, Pb) in Encapsulated Modules and Time-to-Fail Model as a Function of the Environment and Package Properties , 1982, 20th International Reliability Physics Symposium.

[11]  J. Black Electromigration failure modes in aluminum metallization for semiconductor devices , 1969 .

[12]  T. W. Griswold,et al.  Migratory Gold Resistive Shorts: Chemical Aspects of a Failure Mechanism , 1975, 13th International Reliability Physics Symposium.

[13]  Aaron Der Marderosian,et al.  Humidity Threshold Variations for Dendrite Growth on Hybrid Substrates , 1977, 15th International Reliability Physics Symposium.

[14]  T. E. Hartman,et al.  Electromigration in thin gold films , 1969 .

[15]  G. Kortüm,et al.  Treatise on Electrochemistry , 1965 .

[16]  Earl L. Parks,et al.  The Distribution of Electromigration Failures , 1986, 24th International Reliability Physics Symposium.

[17]  E. King Qualitative analysis and electrolytic solutions , 1956 .

[18]  Silver Migration in Glass Dams between Silver-Palladium Interconnections , 1975, IEEE Transactions on Electrical Insulation.

[19]  F. d'Heurle Electromigration and failure in electronics: An introduction , 1971 .

[20]  R. Chaffin Migration of Silver from Silver-Loaded Polyimide Adhesive Chip Bonds at High Temperatures , 1981 .

[21]  R. P. Frankenthal,et al.  Corrosion Failure Mechanisms for Gold Metallizations in Electronic Circuits , 1979 .

[22]  J. Gagne Silver Migration Model for Ag-Au-Pd Conductors , 1982 .

[23]  E. Tsunashima The Sandwich Coating Between Conductive Layers for the Prevention of Silver-Migrations on a Phenolic Board , 1978 .

[24]  A. Mogro-Campero,et al.  Simple estimate of electromigration failure in metallic thin films , 1982 .

[25]  Rolf E. Hummel,et al.  ON THE DIRECTION OF ELECTROMIGRATION IN THIN SILVER, GOLD, AND COPPER FILMS , 1971 .

[26]  R.W. Pasco,et al.  The Application of a Dynamic Technique to the Study of Electromigration Kinetics , 1983, 21st International Reliability Physics Symposium.

[27]  N. Sbar,et al.  Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl 2 , 1976 .

[28]  J. Lahti,et al.  The Characteristic Wearout Process in Epoxy-Glass Printed Circuits for High Density Electronic Packaging , 1979, 17th International Reliability Physics Symposium.

[29]  J. Towner Electromigration-Induced Short Circuit Failure , 1985, 23rd International Reliability Physics Symposium.

[30]  H. Hartnagel,et al.  XPS-Analysis of GaAs-Surface Quality Affecting Interelectrode Material Migration , 1985, 23rd International Reliability Physics Symposium.

[31]  G. Milazzo Electrochemistry: Theoretical Principles and Practical Applications , 1963 .

[32]  L. C. Hall,et al.  A Review of Corrosion Failure Mechanisms during Accelerated Tests Electrolytic Metal Migration , 1987 .

[33]  Saul Chaikin,et al.  Silver Migration and Printed Wiring , 1959 .

[34]  L. Feinstein,et al.  Performance of New Copper-Based Metallization Systems in an 85°C, 78% RH, SO 2 Contaminated Environment , 1979 .

[35]  R. Thomas Moisture, Myths, and Microcircuits , 1976 .

[36]  F. d'Heurle,et al.  Electromigration of Ni in Al thin‐film conductors , 1975 .

[37]  J. Black Physics of Electromigration , 1974 .

[38]  M. S. Frant Copper Sulfide Creep on Porous Electroplate , 1960 .