Reliability Characterization of MEMS Materials
暂无分享,去创建一个
[1] C. J. Wilson,et al. Fracture testing of bulk silicon microcantilever beams subjected to a side load , 1996 .
[2] J. Connally,et al. Slow Crack Growth in Single-Crystal Silicon , 1992, Science.
[3] M. Shikida,et al. Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip , 1998 .
[4] Robert O. Ritchie,et al. High-cycle Fatigue and Durability of Polycrystalline Silicon Thin ®lms in Ambient Air , 2022 .
[5] Eric A. Stach,et al. Mechanism of fatigue in micron-scale films of polycrystalline silicon for microelectromechanical systems , 2002 .
[6] R. Aigner,et al. Fracture strength and fatigue of polysilicon determined by a novel thermal actuator [MEMS] , 2000 .
[7] Mitsuhiro Shikida,et al. Anisotropy in fracture of single crystal silicon film characterized under uniaxial tensile condition , 2005 .
[8] C. Kim,et al. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength , 2000 .
[9] R. L. Edwards,et al. Tensile testing of polysilicon , 1999 .
[10] R. Mullen,et al. The Fracture Toughness of Polysilicon Microdevices , 1998 .
[11] S. Johansson,et al. Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures , 1999 .
[12] Ioannis Chasiotis,et al. Microtensile tests with the aid of probe microscopy for the study of MEMS materials , 2000, SPIE MOEMS-MEMS.
[13] L. Tenerz,et al. Fracture testing of silicon microelements in situ in a scanning electron microscope , 1988 .
[14] Bin Yuan,et al. New test structures and techniques for measurement of mechanical properties of MEMS materials , 1996, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[15] Nao-Aki Noda,et al. Stress concentration factors for round and flat test specimens with notches , 1995 .
[16] David T. Read,et al. Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses , 1995 .
[17] Mehran Mehregany,et al. Mechanical integrity of polysilicon films exposed to hydrofluoric acid solutions , 1990, IEEE Proceedings on Micro Electro Mechanical Systems, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots..
[18] Mitsuhiro Shikida,et al. Tensile-mode fatigue testing of silicon films as structural materials for MEMS , 2001 .
[19] Timothy P. Weihs,et al. Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films , 1988 .
[20] Toshiyuki Tsuchiya,et al. Tensile Testing of Thin Films Using Electrostatic Force Grip , 2001 .
[21] Oliver Paul,et al. Fracture Properties of LPCVD Silicon Nitride Thin Films from the Load-Deflection of Long Membranes , 2002 .
[22] F. Pourahmadi,et al. The effect of corner radius of curvature on the mechanical strength of micromachined single-crystal silicon structures , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.
[23] J. Schweitz,et al. Evaluation of mechanical materials properties by means of surface micromachined structures , 1999 .
[24] William N. Sharpe,et al. Fatigue of polycrystalline silicon under long-term cyclic loading , 2003 .
[25] C. Comi,et al. Mechanical characterization of polysilicon through on-chip tensile tests , 2004, Journal of Microelectromechanical Systems.
[26] O. Tabata,et al. Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films , 1998 .
[27] R. Mullen,et al. Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens† , 1999, Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences.
[28] K. Takashima,et al. Fatigue crack growth behavior of micro-sized specimens prepared from an electroless plated Ni-P amorphous alloy thin film , 2001 .
[29] Y. Isono,et al. High-cycle fatigue damage evaluation for micro-nanoscale single crystal silicon under bending and tensile stressing , 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.
[30] Mark G. Allen,et al. Calibrated measurements of elastic limit, modulus, and the residual stress of thin films using micromachined suspended structures , 1988, IEEE Technical Digest on Solid-State Sensor and Actuator Workshop.
[31] Jari Koskinen,et al. Microtensile testing of free-standing polysilicon fibers of various grain sizes , 1993 .
[32] K. Sato,et al. Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films , 2005, Journal of Microelectromechanical Systems.
[33] Y. Isono,et al. Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM , 2000, Journal of Microelectromechanical Systems.