DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module

[1]  Alex Q. Huang,et al.  Wide Bandgap Devices and Power Conversion Systems - Part II , 2017, IEEE Trans. Ind. Electron..

[2]  Dushan Boroyevich,et al.  10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field , 2020, IEEE Transactions on Power Electronics.

[3]  Michiel Steyaert,et al.  Kuijk Bandgap Voltage Reference With High Immunity to EMI , 2010, IEEE Transactions on Circuits and Systems II: Express Briefs.

[4]  Philippe Ladoux,et al.  Characterization and Implementation of Dual-SiC MOSFET Modules for Future Use in Traction Converters , 2015, IEEE Transactions on Power Electronics.

[5]  Francois Costa,et al.  EMI-Based Current and Voltage Sensing for the Control of Power Electronic Converters , 2018, IEEE Transactions on Circuits and Systems II: Express Briefs.

[6]  Alinaghi Marzoughi,et al.  A Novel Current-Balancing Method for Paralleled MOSFETs in High-Current Solid-State Switch Applications: Paralleling a Large Number of Semiconductor Devices by Adding Inductances in Series , 2020, IEEE Power Electronics Magazine.

[7]  He Li,et al.  Comparison Study of Common-Mode Noise and Thermal Performance for Lateral Wire-Bonded and Vertically Integrated High Power Diode Modules , 2018, IEEE Transactions on Power Electronics.

[8]  Xiaojie Wu,et al.  Performance Evaluation of High-Power SiC MOSFET Modules in Comparison to Si IGBT Modules , 2019, IEEE Transactions on Power Electronics.

[9]  Hui Li,et al.  Prediction of Electromagnetic Interference Noise in SiC MOSFET Module , 2019, IEEE Transactions on Circuits and Systems II: Express Briefs.

[10]  Dushan Boroyevich,et al.  Investigation of Hybrid EMI Filters for Common-Mode EMI Suppression in a Motor Drive System , 2010, IEEE Transactions on Power Electronics.

[11]  Xiang Hao,et al.  Research on a 4000-V-Ultrahigh-Input-Switched-Mode Power Supply Using Series-Connected MOSFETs , 2018, IEEE Transactions on Power Electronics.

[12]  Bo Zhang,et al.  An Advanced Bootstrap Circuit for High Frequency, High Area-Efficiency and Low EMI Buck Converter , 2019, IEEE Transactions on Circuits and Systems II: Express Briefs.

[13]  Chik Patrick Yue,et al.  EMI-Related Common-Mode (CM) Noise Analysis and Prediction of High-Speed Source-Series Terminated (SST) I/O Driver in System-on-Package (SOP) , 2018, IEEE Transactions on Circuits and Systems II: Express Briefs.

[14]  Hans-Peter Nee,et al.  Experimental investigations of static and transient current sharing of parallel-connected silicon carbide MOSFETs , 2013, 2013 15th European Conference on Power Electronics and Applications (EPE).

[15]  Fan Zhang,et al.  Voltage Suppression in Wire-Bond-Based Multichip Phase-Leg SiC MOSFET Module Using Adjacent Decoupling Concept , 2017, IEEE Transactions on Industrial Electronics.