Thermal simulation of semiconductor ICs: general and practical approach

Three-dimensional models of the heat exchange process in semiconductor ICs have been developed. The models were used for the simulation of the thermal resistance of plastic IC packages. The method presented makes it possible to use a combination of the thermal-electrical analogy technique and a 3D analytical approach to simulating the heat removal process in semiconductor IC packages. The utilization of this method is illustrated by an example of the thermal resistance simulation in an IC package.

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