A key parameters interval estimation method of the gold ribbon interconnect structure for the electrical performance of microwave modules

Microwave modules are widely used in the fields of IOT communication, target tracking, space detection, and other aerospace fields. With the development of high integration, high reliability, high-speed transmission and miniaturization of microwave electronic equipment, the influence of interconnection in microwave modules on signal transmission is gradually significant. In this paper, aiming at the typical coaxial and microstrip interconnect structure in microwave modules, an interval estimation method for the key parameters of the gold ribbon interconnect structure is proposed. Based on the shape function cascade, the characterization model of gold ribbon interconnect considering the structural process variations is established. Then, by using experimental design, factor level optimization and multi-objective optimization method, the key parameters for gold ribbon interconnect structure considering process variation and parameter interaction are calculated. Finally, a new method of the weighted sum constraint is used to estimate the key parameter interval of the process variation of the gold ribbon interconnection structure. The method proposed in this paper can solve the problems of determining the effective regulation space and optimal design direction of the high-performance microwave modules circuit interconnects under the consideration of process and manufacturing conditions.