Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 15-18, 1998

Active devices automative electronics ball grid array package chip scale packages design, modeling, simulation flex circuits HDTV high density packaging intelligent transportation interconnects, bonding laser processing management and marketing medical electronics mircowave packaging mobile electronics multichip modules polymeric materials power packaging printed wiring boards programmes in Mexican maquiladoras satellite communications sensors actuators MEMS surface mount technology thick film materials thin film materials wireless packaging.