Equations for Estimating Wire Length in Various Types of 2-D and 3-D System Packaging Structures

Equations for estimating wire lengths in various types of two-dimensional (2-D) and three-dimensional (3-D) cell arrays are introduced'and applications of these equations are described. The singleplane packaging technique is compared with the stacked 2-D technique. The effect of increasing the number of edge connectors for Stacked 2-D designs is evaluated. Also the wire length in 3-D wafer computers is estimated.