Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn–3.5Ag Solder Alloy Under Cyclic Multiaxial Straining

Based on the time dependent multiaxial deformation behavior of 96.5Sn-3.5Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model, the nonproportionality which affects the back stress evolution rate is introduced. The approach for the determination of model parameters is proposed. The model is used to describe the time-dependent cyclic deformation behavior of 96.5Sn-3.5Ag solder alloy under cross, rectangular, rhombic, and double-triangular tensile-torsion multiaxial strain paths at different strain rates with different dwell time. The comparison between the predicted and experimental results demonstrates that the model can satisfactorily describe the time-dependent multiaxial cyclic deformation behavior under complicated nonproportional cyclic straining.

[1]  Sheng Liu,et al.  A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys , 1999 .

[2]  D. Frear.  The Mechanics of Solder Alloy Interconnects , 1993 .

[3]  Sayed A. Nassar,et al.  Constitutive modeling of time-dependent cyclic straining for solder alloy 63Sn–37Pb , 2005 .

[4]  E. Busso,et al.  A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints , 1992 .

[5]  Leon M Keer,et al.  Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder , 1992 .

[6]  Xu Chen,et al.  Multiaxial low-cycle fatigue of 63Sn-37Pb solder , 2005 .

[7]  Xianjie Yang.  Constitutive Description of Temperature-Dependent Nonproportional Cyclic Viscoplasticity , 1997 .

[8]  R. G. Ross,et al.  Comparison of LCC Solder Joint Life Predictions With Experimental Data , 1995 .

[9]  K. J. Lau,et al.  A unified viscoplastic description of 63Sn-37Pb solder alloy under cyclic straining and stressing , 2004 .

[10]  Z. P. Wang,et al.  Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy , 1999 .

[11]  S. V. Harren,et al.  On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder , 1996 .

[12]  K. J. Lau,et al.  Time-dependent cyclic deformation and failure of 63Sn/37Pb solder alloy , 2003 .

[13]  H.L.J. Pang,et al.  Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy , 2000 .

[14]  Wei Zhou,et al.  A modified energy-based low cycle fatigue model for eutectic solder alloy , 1999 .

[15]  H. D. Solomon,et al.  Energy Approach to the Fatigue of 60/40 Solder: Part II— Influence of Hold Time and Asymmetric Loading , 1996 .

[16]  H. D. Solomon,et al.  Energy Approach to the Fatigue of 60/40 Solder: Part I—Influence of Temperature and Cycle Frequency , 1995 .

[17]  M. Fine,et al.  Correlation of uniaxial tension-tension, torsion, and multiaxial tension-torsion fatigue failure in a 63Sn-37Pb solder alloy , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.