Packaging design of wide-angle phased-array antenna for frequencies above 20 GHz

Mechanical aspects of a new phased-array antenna design with a scan angle of /spl plusmn/70 degrees are presented. New packaging concepts were needed to accomplish, an industry first, the fabrication of a 91-element 44-GHz transmit array. The array architecture uses one hybrid module per channel. The RF signal is radiatively coupled to the modules, eliminating RF connectors. Multilayer boards are used to distribute control signals and DC which are connected to each module with space-efficient elastomeric connectors. All connections are made during the assembly of the array without need for permanent bonding. The array is designed for a low conductive thermal impedance from the monolithic microwave integrated circuits (MMIC) chips to the back of the array, where the heat is removed by convection. >