Silicon-Germanium as an Enabling Technology for Extreme Environment Electronics
暂无分享,去创建一个
[1] R. Reed,et al. An investigation of the origins of the variable proton tolerance in multiple SiGe HBT BiCMOS technology generations , 2002 .
[2] L. Najafizadeh,et al. SiGe Profile Optimization for Improved Cryogenic Operation at High Injection , 2006, 2006 Bipolar/BiCMOS Circuits and Technology Meeting.
[3] C. Ulaganathan,et al. SiGe BiCMOS Precision Voltage References for Extreme Temperature Range Electronics , 2006, 2006 Bipolar/BiCMOS Circuits and Technology Meeting.
[4] D. Greenberg,et al. 0.13 /spl mu/m 210 GHz f/sub T/ SiGe HBTs - expanding the horizons of SiGe BiCMOS , 2002, 2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315).
[5] J. Cressler,et al. On the suitability of SiGe HBTs for high-temperature (to 300/spl deg/) electronics , 2004, Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting.
[6] J.D. Cressler. Using SiGe HBT technology for extreme environment electronics , 2005, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..
[7] J. Cressler,et al. An epitaxial emitter-cap SiGe-base bipolar technology optimized for liquid-nitrogen temperature operation , 1994, IEEE Electron Device Letters.
[8] John D. Cressler,et al. A comparison of SEU tolerance in high-speed SiGe HBT digital logic designed with multiple circuit architectures , 2002 .
[9] Laleh Najafizadeh,et al. CMOS reliability issues for emerging cryogenic Lunar electronics applications , 2006 .
[10] M.A. Carts,et al. Proton-induced SEU in SiGe digital logic at cryogenic temperatures , 2007, 2007 International Semiconductor Device Research Symposium.
[11] Chang-Ho Lee,et al. Cryogenic operation of third-generation, 200-GHz peak-f/sub T/, silicon-germanium heterojunction bipolar transistors , 2005, IEEE Transactions on Electron Devices.
[12] John D. Cressler,et al. Temperature Scalable Modeling of SiGe HBT DC Currents Down to 43K , 2006 .
[13] John D. Cressler,et al. A SiGe BiCMOS instrumentation channel for extreme environment applications , 2008 .
[14] J. Cressler,et al. Operation of SiGe heterojunction bipolar transistors in the liquid-helium temperature regime , 1995, IEEE Electron Device Letters.
[15] Leora Peltz,et al. Performance and reliability of SiGe devices and circuits for high-temperature applications , 2009 .
[16] J.D. Cressler,et al. Application of RHBD Techniques to SEU Hardening of Third-Generation SiGe HBT Logic Circuits , 2006, IEEE Transactions on Nuclear Science.
[17] Yuan Yao,et al. A 12-Bit Cryogenic and Radiation-Tolerant Digital-to-Analog Converter for Aerospace Extreme Environment Applications , 2008, IEEE Transactions on Industrial Electronics.
[18] R. Reed,et al. Single event effects in circuit-hardened SiGe HBT logic at gigabit per second data rates , 2000 .
[19] P. Chevalier,et al. Advanced process modules and architectures for half-terahertz SiGe:C HBTs , 2009, 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
[20] G. Vizkelethy,et al. A Novel Device Architecture for SEU Mitigation: The Inverse-Mode Cascode SiGe HBT , 2009, IEEE Transactions on Nuclear Science.
[21] Andrew S. Keys,et al. A Review of NASA's Radiation-Hardened Electronics for Space Environments Project , 2008 .
[22] J.D. Cressler. Using SiGe technology in extreme environments , 2007, 2007 International Semiconductor Device Research Symposium.
[23] Guofu Niu,et al. A Mechanism Versus SEU Impact Analysis of Collector Charge Collection in SiGe HBT Current Mode Logic , 2009, IEEE Transactions on Nuclear Science.
[24] O. Ostinelli,et al. 600 GHz InP/GaAsSb/InP DHBTs Grown by MOCVD with a Ga(As,Sb) Graded-Base and fT x BVCEO ≫ 2.5 THz-V at Room Temperature , 2007, 2007 IEEE International Electron Devices Meeting.
[25] J.D. Cressler. Silicon-Germanium as an Enabling IC Technology for Extreme Environment Electronics , 2008, 2008 IEEE Aerospace Conference.
[26] S. Clark,et al. The effects of proton irradiation on the RF performance of SiGe HBTs , 1999 .
[27] F. Guarin,et al. A comparison of gamma and proton radiation effects in 200 GHz SiGe HBTs , 2005, IEEE Transactions on Nuclear Science.
[28] Qingqing Liang,et al. An Investigation of Negative Differential Resistance and Novel Collector–Current Kink Effects in SiGe HBTs Operating at Cryogenic Temperatures , 2007, IEEE Transactions on Electron Devices.
[29] C. Grens,et al. Assessing reliability issues in cryogenically-operated SiGe HBTs , 2005, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..
[30] Peng Cheng,et al. Impact of Scaling on the Inverse-Mode Operation of SiGe HBTs , 2007, IEEE Transactions on Electron Devices.
[31] M. Turowski,et al. An Evaluation of Transistor-Layout RHBD Techniques for SEE Mitigation in SiGe HBTs , 2007, IEEE Transactions on Nuclear Science.
[32] D. Celi,et al. A conventional double-polysilicon FSA-SEG Si/SiGe:C HBT reaching 400 GHz fMAX , 2009, 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
[33] Yuji Yamamoto,et al. A 0.13µm SiGe BiCMOS technology featuring f T /f max of 240/330 GHz and gate delays below 3 ps , 2009 .
[34] V. Pouget,et al. Laser-Induced Current Transients in Silicon-Germanium HBTs , 2008, IEEE Transactions on Nuclear Science.
[35] Xueyang Geng,et al. A 6th order Butterworth SC low pass filter for cryogenic applications from −180°c to 120°c , 2009, 2009 IEEE Aerospace conference.
[36] J. Babcock,et al. Ionizing radiation tolerance of high-performance SiGe HBT's grown by UHV/CVD , 1995 .
[37] J. Cressler,et al. On the profile design and optimization of epitaxial Si- and SiGe-base bipolar technology for 77 K applications. II. Circuit performance issues , 1993 .
[38] S. Decoutere,et al. A 400GHz fMAX fully self-aligned SiGe:C HBT architecture , 2009, 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
[39] S. Weinreb,et al. SiGe HBT X-Band LNAs for Ultra-Low-Noise Cryogenic Receivers , 2008, IEEE Microwave and Wireless Components Letters.
[40] Bongim Jun,et al. An Investigation of Dose Rate and Source Dependent Effects in 200 GHz SiGe HBTs , 2006, IEEE Transactions on Nuclear Science.
[41] John D. Cressler,et al. On the Potential of SiGe HBTs for Extreme Environment Electronics , 2005, Proceedings of the IEEE.
[42] J. Cressler. Silicon Heterostructure Handbook : Materials, Fabrication, Devices, Circuits and Applications of SiGe and Si Strained-Layer Epitaxy , 2005 .
[43] Wei-Min Lance Kuo,et al. On the high-temperature (to 300/spl deg/C) characteristics of SiGe HBTs , 2004, IEEE Transactions on Electron Devices.
[44] J. Cressler,et al. Simulation of SEE-induced charge collection in UHV/CVD SiGe HBTs , 2000 .
[45] S. Jeng,et al. SiGe HBTs with cut-off frequency of 350 GHz , 2002, Digest. International Electron Devices Meeting,.
[46] Jae-Sung Rieh,et al. On the Performance Limits of Cryogenically Operated SiGe HBTs and Its Relation to Scaling for Terahertz Speeds , 2009, IEEE Transactions on Electron Devices.
[47] P. Chevalier,et al. On the use of cryogenic measurements to investigate the potential of Si/SiGe:C HBTs for terahertz operation , 2007, 2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
[48] John D. Cressler,et al. An SEU hardening approach for high-speed SiGe HBT digital logic , 2003 .
[49] S. Clark,et al. An investigation of the spatial location of proton-induced traps in SiGe HBTs , 1998 .
[50] Yuan Lu,et al. A High-Slew Rate SiGe BiCMOS Operational Amplifier for Operation Down to Deep Cryogenic Temperatures , 2006, 2006 Bipolar/BiCMOS Circuits and Technology Meeting.
[51] R. Berger,et al. Miniaturized Data Acquisition System for Extreme Temperature Environments , 2008, 2008 IEEE Aerospace Conference.
[52] J. Song,et al. Comments on On the base profile design and optimization of epitaxial Si- and SiGe-base bipolar tech , 1997 .
[53] J.D. Cressler. SiGe BiCMOS Technology: An IC Design Platform for Extreme Environment Electronics Applications , 2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.
[54] Bongim Jun,et al. The Effects of Irradiation Temperature on the Proton Response of SiGe HBTs , 2006, IEEE Transactions on Nuclear Science.
[55] J.D. Cressler. SiGe HBT reliability issues associated with operation in extreme environments , 2006, Digest of Papers. 2006 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.
[56] J. Cressler,et al. On the profile design and optimization of epitaxial Si- and SiGe-base bipolar technology for 77 K applications. I. Transistor DC design considerations , 1993 .
[57] John D. Cressler,et al. A novel device structure using a shared-subcollector, cascoded inverse-mode SiGe HBT for enhanced radiation tolerance , 2009, 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
[58] D. Harame,et al. SILICON:GERMANIUM HETEROJUNCTION BIPOLAR TRANSISTORS: FROM EXPERIMENT TO TECHNOLOGY , 1994 .
[59] R. Krithivasan,et al. Half-terahertz operation of SiGe HBTs , 2006, IEEE Electron Device Letters.
[60] J. Cressler,et al. On the High-Temperature (to 300 C) Characteristics , 2004 .
[61] Fan Chen,et al. Silicon-Germanium Heterojunction Bipolar Transistors , 2002 .
[62] Yuji Yamamoto,et al. A 0.13µm SiGe BiCMOS technology featuring fT/fmax of 240/330 GHz and gate delays below 3 ps , 2010, 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
[63] J. Cressler,et al. Sub-1-K Operation of SiGe Transistors and Circuits , 2009, IEEE Electron Device Letters.