Noise Analysis for a SiGe HBT by Hydrodynamic Device Simulation

A detailed analysis of the terminal current noise for a realistic SiGe HBT by hydrodynamicdevice simulation including noise due to electron scattering, hole scattering, Shockley-Read-Hallrecombination,andimpactionization is presented for the first time. It is shown that close to high injection the collector current noise exceeds the corresponding shot noise due to hole scattering within the base. The cross-correlation spectrum of the base and collector current fluctuations is found to be not negligible as often assumed in compact models.

[1]  C. K. Maiti,et al.  Applications of Silicon-Germanium Heterostructure Devices , 2001 .

[2]  Bernd Meinerzhagen,et al.  Consistent Hydrodynamic and Monte-Carlo Simulation of SiGe HBTs Based on Table Models the Relaxation Times , 1998, VLSI Design.

[3]  Fabrizio Bonani,et al.  Generation–recombination noise modelling in semiconductor devices through population or approximate equivalent current density fluctuations , 1999 .

[4]  J.W. Slotboom,et al.  Surface impact ionization in silicon devices , 1987, 1987 International Electron Devices Meeting.

[5]  John D. Cressler,et al.  Re-engineering silicon: Si-Ge heterojunction bipolar technology , 1995 .

[6]  Young Kim,et al.  Si/SiGe:C heterojunction bipolar transistors in an epi-free well, single-polysilicon technology , 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).

[7]  C. Jungemann,et al.  Hierarchical 2D RF noise simulation of Si and SiGe devices by Langevin-type DD and, HD models based on MC generated noise parameters , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

[8]  Christoph Jungemann,et al.  Full-band Monte Carlo device simulation of a Si/SiGe-HBT with a realistic Ge profile , 1999, 1999 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD'99 (IEEE Cat. No.99TH8387).

[9]  J. Slotboom,et al.  Unified apparent bandgap narrowing in n- and p-type silicon , 1992 .

[10]  J.W. Slotboom,et al.  On the Optimisation of SiGe-Base Bipolar Transistors , 1995, ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference.

[11]  W. Maes,et al.  Impact ionization in silicon: A review and update , 1990 .

[12]  Bernd Heinemann,et al.  High-frequency noise analysis of Si/SiGe heterojunction bipolar transistors , 1996 .

[13]  R. L. Johnston,et al.  Measured dependence of lifetime upon local defect density and temperature in depletion layers of epitaxial silicon diodes , 1967 .

[14]  Andreas Schüppen SiGe-HBTs for mobile communication , 1999 .

[15]  Friedrich Schäffler,et al.  High-mobility Si and Ge structures , 1997 .

[16]  C. Jungemann,et al.  Efficient Full-Band Monte Carlo Simulation of Silicon Devices , 1999 .

[17]  Alvin J. Joseph,et al.  Noise modeling and SiGe profile design tradeoffs for RF applications [HBTs] , 2000 .

[18]  Comparative study of electron transit times evaluated by DD, HD, and MC device simulation for a SiGe HBT , 2001 .

[19]  B. Meinerzhagen,et al.  Evaluation of impact ionization modeling in the framework of hydrodynamic equations , 1991, International Electron Devices Meeting 1991 [Technical Digest].

[20]  G. Haddad,et al.  Simulation of GaAs IMPATT diodes including energy and velocity transport equations , 1983, IEEE Transactions on Electron Devices.