Numerical modelling of impact rupture in polysilicon microsystems
暂无分享,去创建一个
Alberto Corigliano | Sarah Zerbini | Attilio Frangi | F. Cacchione | A. Corigliano | A. Frangi | S. Zerbini | Fabrizio Cacchione | Fabrizio Cacchione
[1] Ioannis Chasiotis,et al. Mode I and mixed mode fracture of polysilicon for MEMS , 2007 .
[2] Ioannis Chasiotis,et al. Fracture Toughness and Subcritical Crack Growth in Polycrystalline Silicon , 2006 .
[3] M. Ortiz,et al. Computational modelling of impact damage in brittle materials , 1996 .
[4] Alberto Corigliano,et al. Micro-Scale Simulation of Impact Rupture in Polysilicon MEMS , 2006 .
[5] Somnath Ghosh,et al. Tessellation-based computational methods for the characterization and analysis of heterogeneous microstructures , 1997 .
[6] J. Gardner,et al. Microsensors, MEMS, and Smart Devices: Gardner/Microsensors, MEMS, and Smart Devices , 2001 .
[7] Alberto Corigliano,et al. On-Chip Electrostatically Actuated Bending Tests for the Mechanical Characterization of Polysilicon at the Micro Scale , 2005 .
[8] S. Irving,et al. Free drop test simulation for portable IC package by implicit transient dynamics FEM , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[9] C. Comi,et al. On-chip tensile test for epitaxial polysilicon , 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.
[10] A. Corigliano,et al. Simulation of Impact Rupture in Polysilicon Mems , 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
[11] Somnath Ghosh,et al. Voronoi cell finite element model based on micropolar theory of thermoelasticity for heterogeneous materials , 1995 .
[12] M. Madou. Fundamentals of microfabrication , 1997 .
[13] Rupture tests on polysilicon films through on-chip electrostatic actuation , 2006 .
[14] J. Gardner,et al. Microsensors, MEMS, and Smart Devices , 2001 .
[15] Somnath Ghosh,et al. Extended Voronoi cell finite element model for multiple cohesive crack propagation in brittle materials , 2006 .
[16] W. Brantley. Calculated elastic constants for stress problems associated with semiconductor devices , 1973 .
[17] S. Senturia. Microsystem Design , 2000 .
[18] V.P.W. Shim,et al. Numerical simulation of the drop impact response of a portable electronic product , 2002 .
[19] C. Comi,et al. Mechanical characterization of polysilicon through on-chip tensile tests , 2004, Journal of Microelectromechanical Systems.
[20] H. Espinosa,et al. A grain level model for the study of failure initiation and evolution in polycrystalline brittle materials. Part I: Theory and numerical implementation , 2003 .
[21] I. Chasiotis,et al. Elastic Properties and Representative Volume Element of Polycrystalline Silicon for MEMS , 2006 .
[22] Robert L. Mullen,et al. Monte Carlo simulation of effective elastic constants of polycrystalline thin films , 1997 .
[23] Stefano Mariani,et al. Extended finite element method for quasi‐brittle fracture , 2003 .
[24] Oliver Paul,et al. Mechanical Reliability of MEMS-structures under shock load , 2001, Microelectron. Reliab..
[25] Alberto Corigliano,et al. Formulation, identification and use of interface models in the numerical analysis of composite delamination , 1993 .
[26] G. X Li,et al. Drop test and analysis on micro-machined structures , 2000 .
[27] R. L. Edwards,et al. Tensile testing of polysilicon , 1999 .
[28] N. F. Knight,et al. Adaptive dynamic relaxation algorithm for non-linear hyperelastic structures Part I. Formulation , 1995 .
[29] Alberto Corigliano,et al. Out of plane vs in plane flexural behaviour of thin polysilicon films: Mechanical characterization and application of the Weibull approach , 2005, Microelectron. Reliab..
[30] Robert L. Mullen,et al. Fracture toughness of polysilicon MEMS devices , 2000 .
[31] S.E. Lyshevski,et al. MEMS and NEMS - systems, devices, and structures , 2004, IEEE Electrical Insulation Magazine.
[32] Sergey Edward Lyshevski,et al. Mems and Nems , 2018 .
[33] V. T. Srikar,et al. The reliability of microelectromechanical systems (MEMS) in shock environments , 2002 .
[34] Horacio Dante Espinosa,et al. A grain level model for the study of failure initiation and evolution in polycrystalline brittle materials. Part II: Numerical examples , 2003 .
[35] Somnath Ghosh,et al. Multiple cohesive crack growth in brittle materials by the extended Voronoi cell finite element model , 2006 .