Displacement Activation of Tantalum Diffusion Barrier Layer for Electroless Copper Deposition
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[1] Jung-Yuel Kim,et al. Effects of hydrogen plasma pretreatment on characteristics of copper film deposited by remote plasma CVD using (hfac)Cu(TMVS) , 2000 .
[2] L. J. Chen,et al. Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications , 2000 .
[3] K. Maex,et al. New plating bath for electroless copper deposition on sputtered barrier layers , 2000 .
[4] Jane P. Chang,et al. Integration of fluorinated amorphous carbon as low-dielectric constant insulator: Effects of heating and deposition of tantalum nitride , 1999 .
[5] Jing‐Cheng Lin,et al. Grain Boundary Diffusion of Copper in Tantalum Nitride Thin Films , 1999 .
[6] Mao-chieh Chen,et al. Copper Chemical Vapor Deposition Films Deposited from Cu(1,1,1,5,5,5-hexafluoroacetylacetonate) vinyltrimethylsilane , 1999 .
[7] G. G. Peterson,et al. Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications , 1999 .
[8] Mansoo Park,et al. Comparison of (hexafluoroacetylacetonate)Cu(vinyltrimethylsilane) and (hexafluoroacetylacetonate)Cu(allyltrimethylsilane) for metalorganic chemical vapor deposition of copper , 1999 .
[9] E. Arzt,et al. Textures of thin copper films , 1998 .
[10] F. C. Loh,et al. Sequential Observation of Electroless Copper Deposition via Noncontact Atomic Force Microscopy , 1998 .
[11] Brian W. Johnson,et al. Grain nucleation and texture analysis of electroless copper deposition on a palladium seed layer , 1998 .
[12] T. Osaka,et al. Fabrication of Nickel Dots Using Selective Electroless Deposition on Silicon Wafer , 1998 .
[13] S. Shivashankar,et al. Scanning tunneling microscope study of the morphology of chemical vapor deposited copper films and its correlation with resistivity , 1997 .
[14] S. Karmalkar,et al. A Novel Activation Process for Autocatalytic Electroless Deposition on Silicon Substrates , 1997 .
[15] Y. Shacham-Diamand,et al. Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration , 1997 .
[16] J. Patterson,et al. Selective electroless copper metallization on a titanium nitride barrier layer , 1997 .
[17] S. Shibuki,et al. Copper film formation using electron cyclotron resonance plasma sputtering and reflow method , 1997 .
[18] P. Gorostiza,et al. First stages of platinum electroless deposition on silicon (100) from hydrogen fluoride solutions studied by AFM , 1996 .
[19] X. Jiang,et al. Electroless copper metallisation of titanium nitride , 1995 .
[20] L. Nagahara,et al. Effects of HF solution in the electroless deposition process on silicon surfaces , 1993 .
[21] L. Nagahara,et al. The influence of hydrofluoric acid concentration on electroless copper deposition onto silicon , 1992 .
[22] W. Stickle,et al. Handbook of X-Ray Photoelectron Spectroscopy , 1992 .
[23] L. D’asaro,et al. Electroless Gold Plating on III–V Compound Crystals , 1980 .
[24] TodaFumio,et al. SYNTHESIS AND REACTIONS OF NEW HIGHLY STRAINED UNSATURATED PROPELLANES, [4.2.1]PROPELLA-2,4,7-TRIENES , 1978 .
[25] R. Meek. A Rutherford Scattering Study of Catalyst Systems for Electroless Cu Plating II . Sensitization and Activation , 1975 .