In situ transmission electron microscopy study of Ni silicide phases formed on (001) Si active lines

The formation of Ni silicides is studied by transmission electron microscopy during in situ heating experiments of 12 nm Ni layers on blanket silicon, or in patterned structures covered with a thin chemical oxide. It is shown that the first phase formed is the NiSi2 which grows epitaxially in pyramidal crystals. The formation of NiSi occurs quite abruptly around 400 °C when a monosilicide layer covers the disilicide grains and the silicon in between. The NiSi phase remains stable up to 800 °C, at which temperature the layer finally fully transforms to NiSi2. The monosilicide grains show different epitaxial relationships with the Si substrate. Ni2Si is never observed.The formation of Ni silicides is studied by transmission electron microscopy during in situ heating experiments of 12 nm Ni layers on blanket silicon, or in patterned structures covered with a thin chemical oxide. It is shown that the first phase formed is the NiSi2 which grows epitaxially in pyramidal crystals. The formation of NiSi occurs quite abruptly around 400 °C when a monosilicide layer covers the disilicide grains and the silicon in between. The NiSi phase remains stable up to 800 °C, at which temperature the layer finally fully transforms to NiSi2. The monosilicide grains show different epitaxial relationships with the Si substrate. Ni2Si is never observed.

[1]  K. Tu,et al.  Interactions in the Co/Si thin‐film system. I. Kinetics , 1978 .

[2]  Tung,et al.  Origin of A- or B-type NiSii2 determined by in in situ transmission electron microscopy and diffraction during growth. , 1988, Physical review letters.

[3]  L. J. Chen,et al.  Effects of implantation impurities and substrate crystallinity on the formation of NiSi2 on silicon at 200–280 °C , 1987 .

[4]  J. E. E. Baglin,et al.  Formation of thin films of NiSi: Metastable structure, diffusion mechanisms in intermetallic compounds , 1984 .

[5]  J. Woo,et al.  Salicidation process using NiSi and its device application , 1997 .

[6]  J. Gibson,et al.  In-situ transmission electron microscopy of NiSi2 formation by molecular beam epitaxy , 1989 .

[7]  T. Finstad A Xe Marker Study of the Transformation of Ni2Si to NiSi in Thin Films , 1981, January 16.

[8]  C. Humphreys,et al.  The atomic structure of the NiSi2-(001)Si interface , 1984 .

[9]  R. T. Tung,et al.  Growth of epitaxial NiSi2 on Si(111) at room temperature , 1989 .

[10]  Lun-Lun Chen,et al.  Atomic structure of twin boundary in NiSi2 thin films on (001)Si , 1992 .

[11]  H. Bender,et al.  Comparative study of Ni-silicide and Co-silicide for sub 0.25-mm technologies , 1999 .

[12]  H. Bender,et al.  HREM investigation of twinning in very high dose phosphorus ion-implanted silicon , 1986 .

[13]  P. Ho,et al.  Transmission electron microscopy of the formation of nickel silicides , 1982 .

[14]  C. Cabral,et al.  In Situ Tem Analysis of TiSi 2 C49-C54 Transformations During Annealing , 1996 .

[15]  F. d'Heurle,et al.  Diffusion in intermetallic compounds with the CaF2 structure: A marker study of the formation of NiSi2 thin films , 1982 .

[16]  O. W. Holland,et al.  Formation of ion beam mixed silicides on Si (100) at elevated substrate temperatures , 1985 .

[17]  Fu-Rong Chen,et al.  The atomic structure of Σ=1 and Σ=3 NiSi2/Si interfaces , 1993 .

[18]  J. Sullivan,et al.  Control of interfacial morphology : NiSi2/Si(100) , 1992 .

[19]  D. J. Coe,et al.  Silicide formation in Ni-Si Schottky barrier diodes , 1976 .

[20]  R. T. Tung Oxide mediated epitaxy of CoSi2 on silicon , 1996 .

[21]  T. Ishitani,et al.  Cross‐sectional sample preparation by focused ion beam: A review of ion‐sample interaction , 1996, Microscopy research and technique.

[22]  D. Xu,et al.  Material aspects of nickel silicide for ULSI applications , 1998 .