Design, Fabrication, and Testing of a Bulk Micromachined Inertial Measurement Unit
暂无分享,去创建一个
Qiang Shen | Zhiguang Zhou | Honglong Chang | Weizheng Yuan | Qinghua Jiang | Jianbing Xie | Q. Shen | Honglong Chang | Jianbing Xie | W. Yuan | Zhiguang Zhou | Qinghua Jiang
[1] C. W. Jurgensen,et al. Microscopic uniformity in plasma etching , 1992 .
[2] J. Bernstein,et al. A micromachined comb-drive tuning fork rate gyroscope , 1993, [1993] Proceedings IEEE Micro Electro Mechanical Systems.
[3] B. Puers,et al. Characterization of the electrostatic bonding of silicon and Pyrex glass , 1995 .
[4] Remco J. Wiegerink,et al. RIE lag in high aspect ratio trench etching of silicon , 1997 .
[5] K. Giapis,et al. On the origin of the notching effect during etching in uniform high density plasmas , 1997 .
[6] Timothy S. Cale,et al. Stress distribution in chemical mechanical polishing , 1997 .
[7] Khalil Najafi,et al. A high-sensitivity z-axis capacitive silicon microaccelerometer with a torsional suspension , 1998 .
[8] Roberto Horowitz,et al. Integrated micro-electro-mechanical sensor development for inertial applications , 1998, IEEE 1998 Position Location and Navigation Symposium (Cat. No.98CH36153).
[9] Sekwang Park,et al. A bulk-micromachined three-axis accelerometer using silicon direct bonding technology and polysilicon layer , 1998 .
[10] Sukhan Lee,et al. Micromachined inertial sensors , 1999, Proceedings 1999 IEEE/RSJ International Conference on Intelligent Robots and Systems. Human and Environment Friendly Robots with High Intelligence and Emotional Quotients (Cat. No.99CH36289).
[11] Junseok Chae,et al. A hybrid Silicon-On-Glass (SOG) lateral micro-accelerometer with CMOS readout circuitry , 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).
[12] Francis E. H. Tay,et al. Global optimization and design for microelectromechanical systems devices based on simulated annealing , 2002 .
[13] K. J. Gabriel,et al. Post-CMOS processing for high-aspect-ratio integrated silicon microstructures , 2002 .
[14] D. Cardarelli. An integrated MEMS inertial measurement unit , 2002, 2002 IEEE Position Location and Navigation Symposium (IEEE Cat. No.02CH37284).
[15] K. Najafi,et al. A high-sensitivity silicon accelerometer with a folded-electrode structure , 2003 .
[16] Hao Luo,et al. Integrated multiple-device IMU system with continuous-time sensing circuitry , 2003, 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..
[17] G. Fedder,et al. Fabrication, characterization, and analysis of a DRIE CMOS-MEMS gyroscope , 2003 .
[18] S. Beeby,et al. MEMS Mechanical Sensors , 2004 .
[19] James Sitomer,et al. Low Cost MEMS Inertial Measurement Unit , 2004 .
[20] K. Najafi,et al. A monolithic three-axis micro-g micromachined silicon capacitive accelerometer , 2005, Journal of Microelectromechanical Systems.
[21] Guizhen Yan,et al. Post-CMOS process for high-aspect-ratio monolithically integrated single crystal silicon microstructures , 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..
[22] Jongpal Kim,et al. An x-axis single-crystalline silicon microgyroscope fabricated by the extended SBM process , 2005, Journal of Microelectromechanical Systems.
[23] Kyo-Il Lee,et al. Development and analysis of the vertical capacitive accelerometer , 2005 .
[24] B. Xiong,et al. A novel tuning fork gyroscope with high Q-factors working at atmospheric pressure , 2005 .
[25] Honglong Chang,et al. One Bulk Micromachined Single-Chip Inertial Measurement Unit , 2006, 2006 5th IEEE Conference on Sensors.
[26] J.D. John,et al. Novel concept of a single-mass adaptively controlled triaxial angular rate sensor , 2006, IEEE Sensors Journal.
[27] A.M. Shkel,et al. Inherently robust micromachined gyroscopes with 2-DOF sense-mode oscillator , 2006, Journal of Microelectromechanical Systems.
[28] Honglong Chang,et al. Application of an optimization methodology for multidisciplinary system design of microgyroscopes , 2006 .
[29] A. Kourepenis,et al. Error sources in in-plane silicon tuning-fork MEMS gyroscopes , 2006, Journal of Microelectromechanical Systems.
[30] Huikai Xie,et al. Process Development for CMOS-MEMS Sensors With Robust Electrically Isolated Bulk Silicon Microstructures , 2007, Journal of Microelectromechanical Systems.
[31] Tayfun Akin,et al. A high-performance silicon-on-insulator MEMS gyroscope operating at atmospheric pressure , 2007 .
[32] Nan-Chyuan Tsai,et al. Design and dynamics of an innovative micro gyroscope against coupling effects , 2008 .
[33] Huikai Xie,et al. A Monolithic CMOS-MEMS 3-Axis Accelerometer With a Low-Noise, Low-Power Dual-Chopper Amplifier , 2008, IEEE Sensors Journal.
[34] E. S. Kim,et al. Single- and Triaxis Piezoelectric-Bimorph Accelerometers , 2008, Journal of Microelectromechanical Systems.
[35] F. Ayazi,et al. A 0.1°/HR bias drift electronically matched tuning fork microgyroscope , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.
[36] Pascal Nouet,et al. A CMOS Multi-sensor System for 3D Orientation Determination , 2008, 2008 IEEE Computer Society Annual Symposium on VLSI.
[37] Nan-Chyuan Tsai,et al. Fabrication and analysis of a micro-machined tri-axis gyroscope , 2008 .