论文信息 - Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications

Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications

More and more electronics are being used in climatically harsh environments. Therefore, the challenge of designing climate-protective packaging continues to increase. Still, relatively little is known among design engineers about how to design for robustness and how to model and predict the lifetime of electronics in moist environments and, in particular, in condensing applications.

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