A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

In this paper, we propose a compact and wideband electromagnetic bandgap (EBG) structure using a defected ground structure (DGS) to significantly enhance the wideband suppression of power/ground noise coupling in multilayer packages and printed circuit boards. The proposed EBG structure is implemented simply by adding a rectangular-shaped DGS which is etched periodically onto the ground plane without changing any other geometrical parameter from a mushroom-type EBG structure. The DGS effects on the fL and fU are thoroughly analyzed using the dispersion characteristics. We experimentally verified that the proposed EBG structure achieved the wideband power/ground noise suppression (below -40 dB) between 2.5 and 16.2 GHz. In addition, we demonstrated the considerable reduction in fL from 3.4 to 2.5 GHz and a significant increase in fU from 9.1 to 16.2 GHz when compared with the mushroom-type EBG structure.

[1]  Wei-Da Guo,et al.  A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers , 2006, IEEE Transactions on Microwave Theory and Techniques.

[2]  Reinhold Ludwig,et al.  RF circuit design : theory and applications , 2000 .

[3]  Jinwoo Choi,et al.  Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN) , 2010, IEEE Transactions on Advanced Packaging.

[4]  Tzong-Lin Wu,et al.  Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits , 2005 .

[5]  Chen Jia,et al.  Simultaneous Switching Noise Suppression in Printed Circuit Boards Using a Compact 3-D Cascaded Electromagnetic-Bandgap Structure , 2007, IEEE Transactions on Microwave Theory and Techniques.

[6]  Chen Jia,et al.  A Power Plane With Wideband SSN Suppression Using a Multi-Via Electromagnetic Bandgap Structure , 2007, IEEE Microwave and Wireless Components Letters.

[7]  Ki Hyuk Kim,et al.  Design of EBG Power Distribution Networks With VHF-Band Cutoff Frequency and Small Unit Cell Size for Mixed-Signal Systems , 2007, IEEE Microwave and Wireless Components Letters.

[8]  Tzong-Lin Wu,et al.  Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation , 2010, IEEE Transactions on Electromagnetic Compatibility.

[9]  Jie Qin,et al.  Ultra-Wideband Mitigation of Simultaneous Switching Noise Using Novel Planar Electromagnetic Bandgap Structures , 2006, IEEE Microwave and Wireless Components Letters.

[10]  R. Abhari,et al.  Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[11]  S.D. Rogers.  Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes , 2005, IEEE Transactions on Microwave Theory and Techniques.

[12]  Joungho Kim,et al.  Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications , 2006, IEEE Microwave and Wireless Components Letters.

[13]  Joungho Kim,et al.  High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions , 2005 .

[14]  Tzong-Lin Wu,et al.  A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits , 2005, IEEE Microwave and Wireless Components Letters.