Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification

Condition monitoring power semiconductor devices can inform converter maintenance and reduce damage. This paper presents a method to monitor solder fatigue in a voltage source inverter insulated gate bipolar transistor power module by detecting the change of an inverter output harmonic. It is shown that low-order harmonics, caused by nonideal switching, are affected by the device junction temperature, which in turn depends upon module solder condition. To improve the detection accuracy of the phenomenon, the inverter controller is set to cause harmonic resonance at the target harmonic frequency. The would-be resonance is suppressed by an outer control loop where the control action can be used as the condition monitoring signal. Simulation and experiment are presented to validate the method and evaluate its performance in operation.

[1]  B. Jayant Baliga,et al.  Fundamentals of Power Semiconductor Devices , 2008 .

[2]  L. Meysenc,et al.  Power electronics cooling effectiveness versus thermal inertia , 2005, IEEE Transactions on Power Electronics.

[3]  Peter Tavner,et al.  Condition Monitoring for Device Reliability in Power Electronic Converters: A Review , 2010, IEEE Transactions on Power Electronics.

[4]  T.G. Habetler,et al.  Condition Monitoring of Power Electronic Circuits Using Artificial Neural Networks , 2009, IEEE Transactions on Power Electronics.

[5]  Vijay K. Garg,et al.  Prognostic and Warning System for Power-Electronic Modules in Electric, Hybrid Electric, and Fuel-Cell Vehicles , 2008, IEEE Transactions on Industrial Electronics.

[6]  Silverio Bolognani,et al.  Experimental fault-tolerant control of a PMSM drive , 1998, IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200).

[7]  E. Santi,et al.  Modeling of IGBT Resistive and Inductive Turn-On Behavior , 2005, IEEE Transactions on Industry Applications.

[8]  Peter Tavner,et al.  Change of terminal characteristics of a Voltage-source-inverter (VSI) due to semiconductor device degradation , 2009, 2009 13th European Conference on Power Electronics and Applications.

[9]  Peter Tavner,et al.  Monitoring solder fatigue in a power module using the rise of case-above-ambient temperature , 2010, 2010 IEEE Energy Conversion Congress and Exposition.

[10]  Jerry L. Hudgins,et al.  Modeling of IGBT resistive and inductive turn-on behavior , 2005 .

[11]  Peter Tavner,et al.  Review of condition monitoring of rotating electrical machines , 2008 .

[12]  T.A. Lipo,et al.  On-line dead time compensation technique for open-loop PWM-VSI drives , 1998, APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition.

[13]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[14]  R. Herzer,et al.  Method for electrical detection of bond wire lift-off for power semiconductors , 2003, ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings..

[15]  J. Lau,et al.  Solder Joint Reliability: Theory And Applications , 2014 .

[16]  X. Cheng,et al.  A Prognostic and Warning System for Power Electronic Modules in Electric, Hybrid, and Fuel Cell Vehicles , 2006, Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting.

[17]  L. Ran,et al.  Investigation Into IGBT dV/dt During Turn-Off and Its Temperature Dependence , 2011, IEEE Transactions on Power Electronics.

[18]  Y. Han,et al.  Condition Monitoring Techniques for Electrical Equipment: A Literature Survey , 2002, IEEE Power Engineering Review.

[19]  Davood Yazdani,et al.  A Three-Phase Adaptive Notch Filter-Based Approach to Harmonic/Reactive Current Extraction and Harmonic Decomposition , 2010, IEEE Transactions on Power Electronics.

[20]  D. M. Diebolt,et al.  An experimentally verified IGBT model implemented in the Saber circuit simulator , 1991, PESC '91 Record 22nd Annual IEEE Power Electronics Specialists Conference.

[21]  J. Catt,et al.  Gate drive considerations for IGBT modules , 1992, Conference Record of the 1992 IEEE Industry Applications Society Annual Meeting.

[22]  H. A. Mantooth,et al.  A unified diode model for circuit simulation , 1995 .

[23]  K. S. Smith,et al.  Active filter used as a controlled reactance to prevent harmonic resonance in interconnected offshore power systems , 1999 .

[24]  J.D. vanWyk,et al.  A thermal, mechanical, and electrical study of voiding in the solder die-attach of power MOSFETs , 2006, IEEE Transactions on Components and Packaging Technologies.

[25]  L. Ran,et al.  Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise , 2011, IEEE Transactions on Industry Applications.