All-inkjet-printed electrical components and circuit fabrication on a plastic substrate

The objective of this work is to demonstrate the feasibility of inkjet-printed passive components. All passive components such as resistor, capacitor and inductor were inkjet printed on a polyimide (PI) substrate with various functional inks. For the insulator layer, poly-4-vinylphenol (PVP) and cross linking agent (poly(melamine-co-formaldehyde)) were dissolved in an ethanol. A mixture of poly(3,4-ethylene dioxythiophene) doped with polystyrene sulfonated acid (PEDOT:PSS) and ethylene glycol was used to print a resistor. Barium titanate (BaTiO"3) and soft ferrite (Ni-Zn) powders were added to the synthesized insulator solution to improve its dielectric and magnetic characteristics, respectively. An RC circuit was also fabricated based on the results of the printed passive components. The printed electric components and circuit were characterized using LCR meter, function generator and digital oscilloscope. The measured responses of the printed RC circuit were in good agreement with estimated results.

[1]  Y. S. Kim,et al.  Effects of plasma surface treatments on inkjet-printed feature sizes and surface characteristics , 2011 .

[2]  Hoi-Jun Yoo,et al.  Electrical Characterization of Screen-Printed Circuits on the Fabric , 2010, IEEE Transactions on Advanced Packaging.

[3]  S. Park,et al.  Glycerol-Doped Poly(3,4-ethylenedioxy-thiophene):Poly(styrene sulfonate) Buffer Layer for Improved Power Conversion in Organic Photovoltaic Devices , 2009 .

[4]  J. Oh,et al.  Shapes and morphologies of inkjet‐printed nanosilver dots on glass substrates , 2010 .

[5]  U. Schubert,et al.  Inkjet Printing of Polymers: State of the Art and Future Developments , 2004 .

[6]  Winco K.C. Yung,et al.  Embedded components in printed circuit boards: a processing technology review , 2005 .

[7]  K. Paik,et al.  Screen Printable Epoxy/BaTiO3 Embedded Capacitor Pastes with High Dielectric Constant for Organic Substrate Applications , 2008 .

[8]  Dan Oh,et al.  Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems , 2010, IEEE Transactions on Advanced Packaging.

[9]  Francois Boone,et al.  Creating screen‐printed passive components for microwave applications , 2010 .

[10]  F. Chen,et al.  High‐Conductivity Poly(3,4‐ethylenedioxythiophene):Poly(styrene sulfonate) Film and Its Application in Polymer Optoelectronic Devices , 2005 .

[11]  H. Sirringhaus,et al.  High-Resolution Ink-Jet Printing of All-Polymer Transistor Circuits , 2000, Science.

[12]  V. Subramanian,et al.  An ink-jet-deposited passive component process for RFID , 2004, IEEE Transactions on Electron Devices.

[13]  Je Hoon Oh,et al.  Geometrical characterization of inkjet-printed conductive lines of nanosilver suspensions on a polymer substrate , 2010 .

[14]  P. Kohl,et al.  Novel polymer–ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application , 2002 .

[15]  Jafar Nouri,et al.  Inkjet deposited circuit components , 2010 .

[16]  Rao Tummala,et al.  Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates , 2000 .