Electro-thermal transistor models in the SISSI electro-thermal IC simulator

This paper deals with the modeling solutions and the verification of an electro-thermal simulation program. A method to extend conventional device models to electro-thermal ones is presented. The modeling of special electro-thermal devices such as e.g. the integrated thermocouple is discussed. In order to verify the electro-thermal models, measurement and simulation results are compared. The target device of these investigations is an operational amplifier chip. Several layout arrangements are considered, and the relationship between the layout and the distortions of the electrical operation caused by the thermal feedback is discussed. As a second example, the measured and simulated characteristics of a MEMS electro-thermal converter is compared. The paper deals both with steady-state and dynamic investigations.