Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs

We demonstrate the integration of waveguide-coupled germanium photodiodes onto passive silicon waveguide circuits by means of transfer printing. This involves the release of the photodiodes from the silicon-on-insulator source wafer by underetching the buried oxide layer while protecting the back-end stack. Tethers were formed to keep the released photodiode coupons in place. Coupons were then transfer printed to a silicon photonic target wafer with an alignment accuracy better than ±1 μm. 0.66 A/W waveguide-referred photodiode responsivity at 1550 nm was obtained. High-speed measurements yielded open eye diagrams at 40 Gb/s.

[1]  Gunther Roelkens,et al.  Silicon photonics: Silicon nitride versus silicon-on-insulator , 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).

[2]  G. Roelkens,et al.  100-Gbps RZ Data Reception in 67-GHz Si-Contacted Germanium Waveguide p-i-n Photodetectors , 2017, Journal of Lightwave Technology.

[3]  P. Verheyen,et al.  Active Components for 50 Gb/s NRZ-OOK Optical Interconnects in a Silicon Photonics Platform , 2017, Journal of Lightwave Technology.

[4]  P. Dumon,et al.  Highly Uniform 25 Gb/s Si Photonics Platform for High-Density, Low-Power WDM Optical Interconnects , 2014 .

[5]  Paolo Cardile,et al.  Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters. , 2016, Optics express.

[6]  Nobuhiko Nishiyama,et al.  Vertical trident coupler for 3D optical interconnection , 2016, 2016 IEEE 13th International Conference on Group IV Photonics (GFP).

[7]  Gunther Roelkens,et al.  Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors. , 2017, Optics express.

[8]  John A Rogers,et al.  Competing fracture in kinetically controlled transfer printing. , 2007, Langmuir : the ACS journal of surfaces and colloids.

[9]  Urban Westergren,et al.  50 Gb/s hybrid silicon traveling-wave electroabsorption modulator. , 2011, Optics express.

[10]  Jing Zhang,et al.  Transfer Print Integration of 40Gbps Germanium Photodiodes onto Silicon Photonic ICs , 2017, 2017 European Conference on Optical Communication (ECOC).

[11]  Dong Liu,et al.  Transfer print techniques for heterogeneous integration of photonic components , 2017 .

[12]  E. Menard,et al.  Transfer printing: An approach for massively parallel assembly of microscale devices , 2008, 2008 58th Electronic Components and Technology Conference.