Connecting MOR-based boundary condition independent compact thermal models

The inter-connection of MOR-based boundary condition independent compact thermal models of heat diffusion problems and detailed models of heat transfer problems is here shown not to be straightforward and to introduce numerical difficulties. In order to overcome this drawback, a novel definition of MOR-based boundary condition independent compact thermal models is provided, which makes their inter-connection, as straightforward as the inter-connection of Delphi-like compact thermal models. The resulting MOR-based boundary condition independent compact thermal models can be inter-connected to any detailed model of heat transfer problems and/or to any other MOR-based boundary condition independent compact thermal models, without limitations. The approach is verified analysing a Package on Package application.

[1]  L. Codecasa,et al.  Why matrix reduction is better than objective function based optimization in compact thermal model creation , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[2]  Alessandro Magnani,et al.  Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC) , 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

[3]  Alessandro Magnani,et al.  Matrix reduction tool for creating boundary condition independent dynamic compact thermal models , 2015, 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[4]  M.-N. Sabry,et al.  Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress , 2003 .

[5]  Clemens J. M. Lasance,et al.  Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review , 2008 .

[6]  Alessandro Magnani,et al.  Delphi-like dynamical compact thermal models using model order reduction , 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).