论文信息 - Y 1 Ba 2 Cu 3 O 7– x multilayer structures with a thick SiO 2 interlayer for multichip modules - 字舞流文

Y 1 Ba 2 Cu 3 O 7– x multilayer structures with a thick SiO 2 interlayer for multichip modules

S. Ang | W. Brown | G. Salamo | L. Schaper | Y. Tang | K. Chen | Y. Shi | F. Chan | Q. Xiong | S. Afonso | J. Cooksey | S. Scott