FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT

[1]  J. Lau,et al.  Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substrates , 2002 .

[2]  Lawrence H. Bennett,et al.  Binary alloy phase diagrams , 1986 .

[3]  D. Frear,et al.  Lead-free flip chip interconnect reliability for DCA and FC-PBGA packages , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[4]  Chia-Pin Chiu,et al.  An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[5]  Kyung-Wook Paik,et al.  Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability , 2004 .

[6]  R.W. Johnson,et al.  Wafer-applied underfill: flip-chip assembly and reliability , 2004, IEEE Transactions on Electronics Packaging Manufacturing.

[7]  Robert S. Schwartz,et al.  Solid Logic Technology: Versatile, high-performance microelectronics , 1964, IBM J. Res. Dev..

[8]  W. Engelmaier,et al.  Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards , 1989 .

[9]  C.C. Lee,et al.  A barrier metallization technique on copper substrates for soldering applications , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[10]  Material challenges for wafer level packaging , 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

[11]  G. Margaritis,et al.  The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrates , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[12]  A. Babiarz,et al.  Best practices in automated underfill dispensing , 1998, Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).

[13]  Songhua Shi,et al.  Incorporation of inorganic filler into the no-flow underfill material for flip-chip application , 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

[14]  Reza Ghaffarian Chip Scale Package Assembly Reliability , 2001 .

[15]  Recent advances on a wafer-level flip chip packaging process , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[16]  D.F. Baldwin,et al.  Flip chip processing using wafer-applied underfills , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[17]  S. Jung,et al.  The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-plated Cu substrate , 2004 .

[18]  C. Wong,et al.  A novel approach for incorporating silica filler into no-flow underfill , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[19]  Xiaoyun Ye,et al.  Possibilities and limitations of no-flow fluxing underfill , 2002, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.

[20]  Ching-Ping Wong,et al.  Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion , 1998 .

[21]  C. Wong,et al.  Development of the wafer level compressive-flow underfill process and its required materials , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[22]  Wei Yan Process Development of Double Bump Flip Chip with Enhanced Reliability and Finite Element Analysis , 2005 .

[24]  Mark M. Konarski,et al.  Processing of fluxing underfills for flip chip-on-laminate assembly , 2003 .

[25]  Ching-Ping Wong,et al.  High performance no flow underfills for low-cost flip-chip applications , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[26]  R. Lakes,et al.  High Damping Indium-Tin Alloys , 1999 .

[27]  A practical, flip-chip, multi-layer pre-encapsulation technology for wafer-scale underfill , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[29]  Q. Tan,et al.  Failure mechanisms of flip chip DCA assembly using eutectic solder , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[30]  Trent Thompson,et al.  2001 International Symposium on Advanced Packaging Materials , 2001 .

[31]  Daniel F. Baldwin,et al.  Low cost flip chip processing and reliability of fast-flow, snap-cure underfills , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).