A hands-on multi-disciplinary product development course for micro systems packaging education at Georgia Tech
暂无分享,去创建一个
[1] William A. Wulf,et al. The Urgency of Engineering Education Reform , 1998 .
[2] Rao Tummala,et al. The first entrepreneurial and practice-oriented masters program in microelectronics systems packaging , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
[3] John McMasters,et al. Industry Expectations of New Engineers: A Survey to Assist Curriculum Designers , 1998 .
[4] Gary S. May,et al. The needs, evolution, status and challenges of microelectronics packaging education in the US , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
[5] S. T. M. Ackermans,et al. Engineering Education in the Netherlands: A Renewed Emphasis on Design. , 1988 .
[6] Joseph Bordogna. An Alternative Practice-Oriented Master's Level Program: The ExMSE. , 1991 .