SAVIA, an advanced multi‐layer parallel lamination technique for high density, high performance printed circuit boards

Purpose – To review a newly developed PCB fabrication process based on a parallel lamination technique.Design/methodology/approach – This paper has been written to introduce the SAVIA process, a new parallel lamination technique for PCB fabrication. The basic concept of the SAVIA process has been described along with the individual process steps and the reliability issues. The advantages of SAVIA process have been also discussed in both economical and technological aspects.Findings – It was found that the parallel lamination technique, a key process for SAVIA, was not only highly flexible and reliable but also a cost‐effective fabrication method for high performance PCB. With the SAVIA process, manufacturing lead‐times can be substantially reduced due to the nature of the parallel processing. It was also confirmed that a highly reliable metal alloy interconnection was created between the core and the adhesive layers during the lamination process. The formed metal alloy contacts showed excellent electrical...