Nanomechanical fracture-testing of thin films

Abstract Nanochemical testing techniques were used to quantitatively assess the adhesion of thin film-substrate systems. These techniques utilized micron-scale diamond tips with instrumentation continuously measuring to sub-nanometer and sub-millinewton resolutions. Delamination was modeled as an interfacial crack propagation problem, utilizing linear elastic fracture mechanics and characterized by the critical strain energy release rate. A 9.1 μm thick phenol–formaldehyde polymer film on stainless steel was tested with indentation, scratching and edge-loading of fine lines. Also, sputtered copper and tungsten–copper bilayer films on SiO2, 150 to 1500 nm thick, were tested with indentation.

[1]  A. Evans,et al.  The cracking and decohesion of thin films , 1988 .

[2]  M. D. Thouless,et al.  Growth and configurational stability of circular, buckling-driven film delaminations , 1992 .

[3]  M. Thouless,et al.  Effects of residual stresses in the blister test , 1993 .

[4]  John W. Hutchinson,et al.  Decohesion of a cut prestressed film on a substrate , 1990 .

[5]  A. Evans,et al.  The fracture energy of bimaterial interfaces , 1990 .

[6]  Zhigang Suo,et al.  Sandwich test specimens for measuring interface crack toughness , 1989 .

[7]  V. Sarin,et al.  Micro-scratch test for adhesion evaluation of thin films , 1993 .

[8]  K. Johnson.  Contact Mechanics: Frontmatter , 1985 .

[9]  Robert O. Ritchie,et al.  Subcritical Crack Growth along Ceramic‐Metal Interfaces , 1987 .

[10]  George M. Pharr,et al.  Measurement of Thin Film Mechanical Properties Using Nanoindentation , 1992 .

[11]  OBSERVATIONS AND SIMPLE FRACTURE MECHANICS ANALYSIS OF INDENTATION FRACTURE DELAMINATION OF TIN FILMS ON SILICON , 1994 .

[12]  T. Nsongo,et al.  Adhesion characterization of titanium and titanium nitride thin coatings on metals using the scratch test , 1995 .

[13]  T. W. Wu.  Microscratch and load relaxation tests for ultra-thin films , 1991 .

[14]  Herbert F. Wang,et al.  Single Crystal Elastic Constants and Calculated Aggregate Properties. A Handbook , 1971 .

[15]  M. D. Thouless,et al.  The edge cracking and spalling of brittle plates , 1987 .

[16]  James R. Rice,et al.  Elastic Fracture Mechanics Concepts for Interfacial Cracks , 1988 .

[17]  M. P. Boer,et al.  Investigation of a new fracture mechanics specimen for thin film adhesion measurement , 1997 .

[18]  A. Evans,et al.  A Simple Method for Adhesion Measurements , 1981 .

[19]  D. Rickerby.  A review of the methods for the measurement of coating-substrate adhesion☆ , 1988 .

[20]  J. Hutchinson,et al.  Diamond Coating of Titanium Alloys , 1994, Science.

[21]  R. Plunkett,et al.  Formulas for Stress and Strain , 1965 .

[22]  R. M. Cannon,et al.  CERAMIC/METAL INTERFACIAL CRACK GROWTH: TOUGHENING BY CONTROLLED MICROCRACKS AND INTERFACIAL GEOMETRIES , 1988 .

[23]  B. D. Agarwal,et al.  Analysis and Performance of Fiber Composites , 1980 .

[24]  Z. Suo,et al.  Interface crack between two elastic layers , 1990 .

[25]  Anthony G. Evans,et al.  Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination , 1984 .

[26]  Anthony G. Evans,et al.  Effects of non-planarity on the mixed mode fracture resistance of bimaterial interfaces , 1989 .

[27]  D. T. Quinto,et al.  Adhesion measurements of chemically vapor deposited and physically vapor deposited hard coatings on WCCo substrates , 1987 .

[28]  I. Blech,et al.  Mechanical Properties of Thin Films on Substrates , 1982 .

[29]  M. D. Thouless,et al.  Plane-strain, buckling-driven delamination of thin films: Model experiments and mode-II fracture , 1992 .

[30]  The fracture resistance of metal-ceramic interfaces , 1993 .

[31]  D. Bahr,et al.  Effect of in and Out of Plane Stresses During Indentation of Diamond Films on Metal Substrates , 1996 .

[32]  M. P. Boer,et al.  Microwedge indentation of the thin film fine line—II. Experiment , 1996 .

[33]  A. Evans,et al.  On crack extension in ductile/brittle laminates , 1991 .

[34]  Zhigang Suo,et al.  Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches , 1990 .

[35]  Z. Suo,et al.  Mixed mode cracking in layered materials , 1991 .

[36]  W. Gerberich,et al.  Continuous microscratch measurements of thin film adhesion strengths , 1993 .

[37]  Anthony G. Evans,et al.  On the mechanics of delamination and spalling in compressed films , 1984 .

[38]  Kenneth M. Liechti,et al.  Biaxial Loading Experiments for Determining Interfacial Fracture Toughness , 1991 .

[39]  J. Hutchinson,et al.  Kinking of A Crack Out of AN Interface , 1989 .

[40]  W. D. Kingery,et al.  Introduction to Ceramics , 1976 .

[41]  R. King,et al.  Elastic analysis of some punch problems for a layered medium , 1987 .

[42]  P. Steinmann,et al.  A review of the mechanical tests for assessment of thin‐film adhesion , 1989 .

[43]  M. P. Boer,et al.  Microwedge indentation of the thin film fine line—I. Mechanics , 1996 .

[44]  S. Bull,et al.  Mechanical properties of ion-beam deposited diamond-like carbon on polymers , 1994 .

[45]  J. E. Ritter,et al.  Use of the Microindentation Technique for Determining Interfacial Fracture Energy , 1990 .

[46]  D. Tabor.  Hardness of Metals , 1937, Nature.

[47]  A. G. Evans,et al.  An experimental study of the fracture resistance of bimaterial interfaces , 1989 .

[48]  Anthony G. Evans,et al.  Kinking of a Crack out of an Interface: Role of In‐Plane Stress , 1991 .