MMIC in-circuit and in-device testing with an on-wafer high frequency electric force microscope test system

Abstract In-circuit and in-device tests give valuable information for detailed function and failure analysis of monolithic microwave integrated circuits (MMIC), if simultaneously high spatial resolution, GHz signal measurement ability and topographic imaging are achieved. Therefore a new high frequency electric force microscope was used to investigate the electrical behavior and function of devices and components within a 0–27 GHz traveling wave amplifier (TWA) by spatially resolved on wafer mappings of device internal voltages. Furthermore, comparisons between measured and simulated data allow the internal localization of malfunction MMIC components, to give hints for a re-design.