Circuit reliability simulator for interconnect, via, and contact electromigration
暂无分享,去创建一个
Peng Fang | Chenming Hu | Nathan W. Cheung | B. K. Liew | C. Hu | N. Cheung | B. Liew | P. Fang
[1] Electromigration characteristics of tungsten plug vias under pulse and bidirectional current stressing , 1991, IEEE Electron Device Letters.
[2] T. Kwok,et al. Effect of metal line geometry on electromigration lifetime in Al-Cu submicron interconnects , 1988 .
[3] D. Burnett,et al. Bipolar circuit reliability simulation , 1990, International Technical Digest on Electron Devices.
[4] J. M. Towner. Are electromigration failures lognormally distributed , 1990 .
[5] J. Maiz. Characterization of electromigration under bidirectional (BC) and pulsed unidirectional (PDC) currents , 1989 .
[6] K. F. Poole,et al. RELIANT: a reliability analysis tool for VLSI interconnect , 1989 .
[7] Ibrahim N. Hajj,et al. Probabilistic simulation for reliability analysis of CMOS VLSI circuits , 1990, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[8] E. Kinsbron,et al. A model for the width dependence of electromigration lifetimes in aluminum thin‐film stripes , 1980 .
[9] K. Seki,et al. Circuit aging simulator (CAS) , 1988, Technical Digest., International Electron Devices Meeting.
[10] H. H. Hoang,et al. Electromigration early‐failure distribution , 1989 .
[11] Chenming Hu,et al. Projecting interconnect electromigration lifetime for arbitrary current waveforms , 1990 .
[12] Elyse Rosenbaum,et al. Circuit reliability simulator-oxide breakdown module , 1989, International Technical Digest on Electron Devices Meeting.
[13] B. Agarwala,et al. Dependence of Electromigration‐Induced Failure Time on Length and Width of Aluminum Thin‐Film Conductors , 1970 .
[14] Earl L. Parks,et al. The Distribution of Electromigration Failures , 1986, 24th International Reliability Physics Symposium.