A TSV-based architecture for AC-DC converters

In this paper, a proposed through silicon via (TSV) structure is used to construct AC-DC converters. This structure is analyzed using 3D electromagnetic full-wave simulators. The results show that the proposed 3D converter exhibits small area with superior performance compared to a 2D transformer, for the same footprint as lossy substrate effects are neglected for low frequency range of interest for DC converters.

[1]  E. Friedman,et al.  Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance , 2009, IEEE Transactions on Electron Devices.

[2]  R. Suaya,et al.  Compact AC modeling and analysis of Cu, W, and CNT based through-silicon vias (TSVs) in 3-D ICs , 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

[3]  Kiat Seng Yeo,et al.  Fully Symmetrical Monolithic Transformer (True 1 : 1) for Silicon RFIC , 2008, IEEE Transactions on Microwave Theory and Techniques.

[4]  Eby G. Friedman,et al.  Electrical modeling and characterization of 3-D vias , 2008, 2008 IEEE International Symposium on Circuits and Systems.

[5]  Joungho Kim,et al.  Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation , 2007, 2007 International Conference on Electronic Materials and Packaging.

[6]  S. Wong,et al.  Physical modeling of spiral inductors on silicon , 2000 .

[7]  Hannu Tenhunen,et al.  Closed-Form Equations for Through-Silicon Via (TSV) Parasitics in 3-D Integrated Circuits (ICs) , 2009 .

[8]  E. Li,et al.  Signal integrity analysis of through-silicon via based 3D integrated circuit , 2010, 2010 International Symposium on Signals, Systems and Electronics.

[9]  W. Dehaene,et al.  Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs , 2010, IEEE Transactions on Electron Devices.

[10]  Junho Lee,et al.  High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package , 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..

[11]  Pascal Ancey,et al.  Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits , 2009, 2009 IEEE International Conference on 3D System Integration.

[12]  Eby G. Friedman,et al.  On-chip DC-DC converters for three-dimensional ICs , 2009, 2009 10th International Symposium on Quality Electronic Design.

[13]  B. Dang,et al.  3D chip stack with integrated decoupling capacitors , 2009, 2009 59th Electronic Components and Technology Conference.

[14]  Joungho Kim,et al.  High Frequency Electrical Model of Through Wafer Via for 3-D Stacked Chip Packaging , 2006, 2006 1st Electronic Systemintegration Technology Conference.