A bonding appartus

The present invention relates to bonding apparatus for mounting an integrated circuit device for a liquid crystal display panel, particularly to the management of the flatness of the bonding portion can be easily performed, the compression process of the integrated circuit device with respect to the liquid crystal display panels of different sizes to provide a bonding apparatus that can be performed it is an object. The present invention for achieving these objectives is the frame; In order to attach the integrated circuit device for a liquid crystal display panel providing a bonding apparatus comprising a bonding portion provided in a plurality in the frame, it is connected to the bonding unit parts move for adjusting the spacing between the bonded portion and is.